Sat, Apr 6, 2024 - 8:00 AM to 5:00 PM
Saturday: 5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Committee Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Committee Chair: Milea Kammer, Engineering Manager, Honeywell International
Committee Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Committee Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Ballroom A
Sun, Apr 7, 2024 - 8:00 AM to 5:00 PM
5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Committee Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Committee Chair: Milea Kammer, Engineering Manager, Honeywell International
Committee Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Committee Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Ballroom A
Sun, Apr 7, 2024 - 8:00 AM to 4:45 PM
7-31A/D-33A: IPC-A-600 and IPC-6012 Joint Task Group Meeting
Committee Chair: Gerry Partida, Dir. Of Technology, Summit Interconnect - Anaheim
Committee Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff, Lockheed Martin Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210CD
Mon, Apr 8, 2024 - 8:00 AM to 12:00 PM
3-11A: Base Materials Committee
Committee Chair: Albert Block, Chief Manufacturing Strategist, National Instruments
Committee Chair: Darren Hitchcock, OEM Business Development Manager, Panasonic Industrial Devices Sales Company of America
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 213D
Mon, Apr 8, 2024 - 8:00 AM to 10:00 AM
5-21H: Bottom Termination Components (BTC) Task Group
Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210B
Mon, Apr 8, 2024 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Task Group
Committee Chair: Ernst Eggelaar, CEO, Microtronic
Committee Chair: Gerard O'Brien, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207A
Mon, Apr 8, 2024 - 8:00 AM to 12:00 PM
5-32G: Residue Assessment Task Group
Committee Chair: Eric Camden, Lead Investigator, Foresite, Inc.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Mon, Apr 8, 2024 - 8:00 AM to 10:00 AM
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
Committee Chair: Benoit Dagenais, Electric Vehicle Lead Technician, Innovative Vehicle Institute
Committee Chair: Tyler Siebert, Lockheed Martin Missiles & Fire Control
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 209B
Mon, Apr 8, 2024 - 8:00 AM to 5:00 PM
7-31J: IPC-A-630 Task Group
Committee Chair: Eddie Hofer, M&P Engineer, Collins Aerospace
Committee Chair: Richard Rumas, Technical Manager - Materials Engineering, Honeywell Canada
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 213C
Mon, Apr 8, 2024 - 8:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 210A
Mon, Apr 8, 2024 - 8:00 AM to 10:00 AM
D-33: Performance Standards Subcommittee
Committee Chair: Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207D
Mon, Apr 8, 2024 - 8:00 AM to 12:00 PM
E-31: Supplier Declaration Subcommittee
Committee Chair: Chuck LePard, DXC Technology
Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
Committee Chair: Randall Flinders, Compliance Specialist, GreenSoft Technology Inc.
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 209A
Mon, Apr 8, 2024 - 10:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum
Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 213A
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
2-17A: IPC-CFX Standard Task Group
Committee Chair: Thomas Marktscheffel, Director of R&D, ASMPT GmbH & Co. KG
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 208A
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
5-23A: Printed Board Solderability
Committee Chair: Ernst Eggelaar, CEO, Microtronic
Committee Chair: Gerard O'Brien, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207A
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
D-55/D-55A: Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group
Committee Chair: Bhanu Sood PhD, Deputy Chief Technologist, Office of the Director, NASA Goddard Space Flight Center
Committee Chair: Raj Kumar, Northrop Grumman Space Systems
General Committee: Embedded Devices
Event Type: Standards Development Meeting
Location: 207D
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
IPC-V-TSL-MVIA-EU: Micro Via Task Group
Committee Chair: Maarten Cauwe PhD, R&D Team Leader, imec
Committee Chair: Stan Heltzel, Materials Engineer at European Space Agency-ESA, European Space Agency-ESA
Event Type: Standards Development Meeting
Location: 207B
Mon, Apr 8, 2024 - 1:30 PM to 5:00 PM
2-16: Digital Product Model Exchange (DPMX) Subcommittee
Committee Chair: Chris Shaw, Fujitsu Network Communications
Committee Chair: Terry Hoffman, Technical Leader, Cisco Systems Inc.
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 208A
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
2-30: Terms and Definitions Committee
Committee Chair: Aaron Kennedy, Summit Interconnect - Anaheim
Committee Chair: David Caputa, Electronics Engineer, Lockheed Martin Corporation
General Committee: Terms and Definitions
Event Type: Standards Development Meeting
Location: 207D
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
3-12D: Woven Glass
Committee Chair: Thomas Keily, General Manager, JPS Composite Materials Corp.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 213D
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
4-14F: ENEPIG Task Group
Committee Chair: Jose Rios, Senior Principal Quality Engineer/Supplier Quality Manage, Raytheon
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207A
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
5-21F: Ball Grid Array Task Group
Committee Chair: Robert Rowland, Engineering Manager, Axiom Electronics, LLC
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210A
Mon, Apr 8, 2024 - 1:30 PM to 5:00 PM
5-33A: Conformal Coating Task Group
Committee Chair: Brian Chislea, AETS, Dow Corning
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
7-31FT: IPC/WHMA-A-620 Training Committee
Committee Chair: Debbie Wade, Master IPC Trainer, Advanced Rework Technology
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210B
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
D-61B/D-64B: Rigid Printed Electronics Design Standard and Printed Electronics on Rigid Substrates Performance Specification joint meeting
Committee Chair: Jeff Shubrooks, Raytheon Company
General Committee: Printed Electronics
Event Type: Standards Development Meeting
Location: 207C
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
2-19A: Critical Components Traceability Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
3-12E:Base Materials Roundtable Task Group
Committee Chair: Terry Fischer, VP Sales and Marketing, Showa Denko Materials (America), Inc.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 213D
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
4-14B: ENIG Task Group
Committee Chair: Ingrid Swenson, Inner layer engineering manager, TTM Technologies, Inc.
General Committee: PCB Fabrication and Materials
Event Type: Standards Development Meeting
Location: 207A
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
5-21G: Flip Chip Mounting Task Group
Committee Chair: Ife Hsu, Technology & Standards Development Lead, Intel Corporation
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210A
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Committee Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 207D
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
Faces of the Future
Event Type: Standards Development Meeting
Location: 209B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
2-19B: Trusted Supplier Task Group
Committee Chair: Richard Snogren, President, Bristlecone LLC
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Committee Chair: Erik Bergum, VP Technology and Engineering, Founder PCB USA
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 207D
Tue, Apr 9, 2024 - 10:00 AM to 5:00 PM
3-14A: IC substrate Task Group
Committee Chair: Gang Liu, Shennan Circuits Co. Ltd.
Event Type: Standards Development Meeting
Location: 210B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
5-33B: Solder Mask Task Group
Committee Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210A
Tue, Apr 9, 2024 - 10:00 AM to 3:00 PM
5-33C: Conformal Coating Handbook Task Group
Committee Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica International L.P.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
7-24B: Printed Board Assembly Process Handbook Task Group
Committee Chair: Zhiman Susann Chen, Senior Engineer, ZhuZhou CRRC Times Electric Co., Ltd.
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 208B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
7-31BT: IPC-A-610 Training Committee
Committee Chair: Helena Pasquito, Master IPC Trainer, EPTAC Corporation
Committee Chair: Marie Parliman, Technical Instructor, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 213D
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Committee Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
D-22: RF/Microwave Printed Board Performance Subcommittee
Committee Chair: Lance Auer, Engineering Fellow, Conductor Analysis Technologies, Inc.
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 207A
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
D-25A: Design and Test Requirements for High Speed Connectors in High Reliability Applications
Committee Chair: Hermann Eicher, Project Manager R&D, EPT GmbH
Committee Chair: Robert Kinyanjui, John Deere Electronic Solutions
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 213A
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
V-TSL: Technology Solutions Committee
Committee Chair: Michael Carano, VP Technology and Bus. Dev, IPC
Event Type: Standards Development Meeting
Location: 209A
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
2-12D: Digital Sustainability Credentials Standard Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213A
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
5-22F: IPC-HDBK-001 Task Group
Committee Chair: John Mastorides, Principle Product Design Engineer, Honeywell Aerospace
Committee Chair: Scott Meyer, Collins Aerospace
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207B
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
5-32E: CAF Task Group
Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 207D
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
6-10D: SMT Attachment Reliability Task Group
Committee Chair: Reza Ghaffarian PhD, Principal Engineer, Jet Propulsion Laboratory
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 210A
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Committee Chair: Michael Creeden, Technical Director Design Education, Insulectro
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
D-33AA: IPC-6012 Automotive Addendum
Committee Chair: Jan Pedersen, Director of Technology, Elmatica AS
Committee Chair: Todd MacFadden, Senior Technology Development Project Manager, Bose Corporation
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 213C
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
D-67A, D-67B and D-67C: Joint Task Group Meeting
Committee Chair: Dana Korf, Nano Dimension
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
General Committee: Printed Electronics
Event Type: Standards Development Meeting
Location: 208B
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
E-31K: Materials and Substances Declaration for the Aerospace, Defense, HE and Other Industries
Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
Tue, Apr 9, 2024 - 1:30 PM to 6:00 PM
IPC Design Competition Finals
Event Type: Standards Development Meeting
Location: 213B
Tue, Apr 9, 2024 - 3:00 PM to 5:00 PM
7-34: IPC-7711/21 Rework, Repair and Modification
Committee Chair: Frank Honyotski, Instructor, STI Electronics, Inc.
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 208B
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
Committee Chair: Shuming Gao, Professor, Zhejiang University
Committee Chair: Victor Xu, Huawei Technologies Co. Ltdol
Committee Chair: Zhiqian Sang, Hangzhou Dianzi University
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213A
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Committee Chair: Milea Kammer, Engineering Manager, Honeywell International
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207D
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
5-33F: Potting and Encapsulation Task Group
Committee Chair: Brian Chislea, AETS, Dow Corning
Committee Chair: Torrey Clark, Technical Service and Development Engineer, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
EMS Steering Committee
Event Type: Standards Development Meeting
Location: 210A
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
2-12C: Cybersecurity Protection Standard Task Group
Committee Chair: Hiroyuki Watanabe, CO, NEC Platforms Ltd.
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213B
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
2-16D: IPC-2581 Users Task Group
Committee Chair: Kevin Kusiak, LM Associate Fellow, Lockheed Martin Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
Committee Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 213A
Wed, Apr 10, 2024 - 8:00 AM to 12:00 PM
5-21M: Cold Joining/Press-fit Task Group
Committee Chair: Erika Crandall PhD, Principal R&D Development Engineer, TE Connectivity
Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 213C
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
5-22BT: J-STD-001 Training Committee
Committee Chair: George Tristan, Process Control Engineer, Ball Aerospace & Technologies Corp.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210B
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
5-24B: Solder Paste Task Group
Committee Chair: Beverley Christian, Project Facilitator, HDP User Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 208A
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
5-24G: Polymerics Standard Task Group
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207D
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Committee Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 304CD
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
D-15: Flex Test Methods Methods Subcommittee
Committee Chair: Russell Shepherd, General Manager - Anaheim, NTS - Anaheim
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Committee Chair: Herb Snogren, Consultant, Bristlecone LLC
Committee Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 207A
Wed, Apr 10, 2024 - 8:00 AM to 5:00 PM
E-31B: Materials Declaration Task Group
Committee Chair: Jason Gooden, Executive Director, Anthesis
Committee Chair: JB Hollister, Environmental Engineer, Apple Inc.
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 207B
Wed, Apr 10, 2024 - 10:00 AM to 12:00 PM
1-14: DFX Standards Subcommittee
Committee Chair: Kevin Kusiak, LM Associate Fellow, Lockheed Martin Corporation
Committee Chair: Pietro Vergine, President, Advanced Rework Technology
Committee Chair: Stephen Golemme, Manufacturing Engineer, ITX Inc.
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: 207C
Wed, Apr 10, 2024 - 10:00 AM to 12:00 PM
5-24A: Flux Specification Task Group
Committee Chair: Anthony Lentz, Chemist / Field Application, FCT Assembly, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 208A
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
2-12A: Generic Requirements for Digital Twin Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213B
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
3-11J: Metal Based Laminates for Printed Boards
Committee Chair: Minsu Lee, Manager, Korea Packaging Integration Association
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 207A
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
7-12: Microsection Subcommittee
Committee Chair: Allen Keeney, Johns Hopkins University
General Committee: Testing
Event Type: Standards Development Meeting
Location: 213A
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
7-31AT & D-33AT: IPC-A-600 and IPC-6012 Training Joint Meeting
Committee Chair: Jamie Noland, Marketing Manager/MIT, Blackfox Training Institute
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210B
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
7-31K/7-31H: Wire Harness Design and IPC-HDBK-620 Handbook Joint Task Group Meeting
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207D
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
D-12: Flexible Printed Circuits Performance Subcommittee
Committee Chair: Nick Koop, Director of Flex Technology, TTM Technologies
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Wed, Apr 10, 2024 - 1:30 PM to 5:00 PM
5-21N: Cold Joining/Press-fit Handbook Task Group
Committee Chair: Erika Crandall PhD, Principal R&D Development Engineer, TE Connectivity
Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 213C
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
5-22AS: Space and Military Electronic Assemblies Task Group
Committee Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210A
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
5-22H: Thermal Profiling Guide Task Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 208A
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
5-31J: Cleaning Compatibility
Committee Chair: William Capen, Senior Engineering Tech Specialist, Honeywell FM&T
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 213A
Wed, Apr 10, 2024 - 1:30 PM to 5:00 PM
5-33A: Conformal Coating Task Group
Committee Chair: Brian Chislea, AETS, Dow Corning
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
7-25A: Automated Optical Inspection Process Control Standard Task Group
Committee Chair: Feng Xue, IBM Infrastructure
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 207A
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
7-34T: IPC-7711 7721 Training Committee
Committee Chair: Frank Honyotski, Instructor, STI Electronics, Inc.
Committee Chair: Nichole Thilges, Sr. Training and Development Spc, Raytheon Missile Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210B
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Committee Chair: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc.
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
D-23: High Speed High Frequency Base Materials Subcommittee
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 209B
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
ESDS Control Plan
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Event Type: Standards Development Meeting
Location: 207C
Wed, Apr 10, 2024 - 3:00 PM to 5:00 PM
7-25B AOI Process Control for IC Substrates Standard Task Group
Committee Chair: Botao Zhang
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 207A
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM
7-31N: Manual Magnification Aides Task Group
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
Event Type: Standards Development Meeting
Location: 210A
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM
B-10A: Plastic Chip Carrier Cracking Task Group
Committee Chair: Christina Landon, Engineer, Naval Surface Warfare Ctr
Committee Chair: Steve Martell, Nordson ASYMTEK
General Committee: Packaged Electronic Components
Event Type: Standards Development Meeting
Location: 213A
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM
D-13: Flex Circuits Base Materials
Committee Chair: Richard Wessel, Technical Supervisor, DuPont Electronics & Imaging
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM
D-21C: High Speed/High Frequency Controlled Impedance T.G
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 207C
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Committee Chair: Michelle Gleason, Staff DFX Engineer, Plexus Corp.
General Committee: Electronic Packaging Design
Event Type: Standards Development Meeting
Location: 207D
Thu, Apr 11, 2024 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Committee Chair: Beverley Christian, Project Facilitator, HDP User Group
Committee Chair: Christina Landon, Engineer, Naval Surface Warfare Ctr
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 207A
Thu, Apr 11, 2024 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Committee Chair: Catherine Hanlin, General Manager / Quality Manager, Precision Manufacturing Company, Inc.
Committee Chair: George Millman, Quality Engineer, Raytheon Missile Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210CD
Thu, Apr 11, 2024 - 8:00 AM to 12:00 PM
E-31J: Lab Report Declaration Task Group
Committee Chair: Jason Gooden, Executive Director, Anthesis
Committee Chair: JB Hollister, Environmental Engineer, Apple Inc.
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 208A
Thu, Apr 11, 2024 - 8:00 AM to 5:00 PM
PERM 56
Event Type: Standards Development Meeting
Location: 207D
Thu, Apr 11, 2024 - 8:00 AM to 5:00 PM
UL Meeting
Event Type: Standards Development Meeting
Location: 213A
Thu, Apr 11, 2024 - 1:30 PM to 5:00 PM
E-31H: Conflict Minerals Due Diligence Task Group Meeting
Committee Chair: Kazuko Andersen, Deputy Director, JEITA
Committee Chair: Nikki Johnson, Director Environmental Engineering, Source Intelligence
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 208A
Fri, Apr 12, 2024 - 8:00 AM to 5:00 PM
PERM 56
Event Type: Standards Development Meeting
Location: 207D