Agenda Planner - Programs

Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD01: Reflow Soldering Process and Influence on Defects " An In-Depth Look Instructor: Dr. S. Manian Ramkumar, Dean of the College of Engineering Technology, Rochester Institute of Technology (RIT) Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD01-S. Manian Ramkumar
Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD02: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World Instructor: Ray Prasad, President, Ray Prasad Consultancy Group Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD02_Ray Prasad
Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD03: Designing with HDI Technology Instructor: Susy Webb, SR PCB Design Engineer, Design Science Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD03_Susy Webb
Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD04: Preventing Manufacturing Defects and Product Failure Instructor: Dr. Jennie Hwang, President, H-Technologies Group Seminar Type: Professional Development Track: Quality, Reliability, Assembly, Test and Inspection Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD04-Jennie Hwang
Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD06: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly), DFF (Design for Printed Board Fabrication) and More - Part I Instructor: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD06_DaleLee
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD08: Stencil Printing Process and Solder Paste Inspection " An In-Depth Look Dr. S. Manian Ramkumar, Dean of the College of Engineering Technology, Rochester Institute of Technology (RIT) Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD08-S. Manian Ramkumar
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD09: Power Electronics in Manufacturing: Operations and Application Instructor: Brian Zahnstecher, Principal, PowerRox Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD09-Brian Zahnstecher
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD10: Mentoring Extended PCB Design Techniques Instructor: Susy Webb, SR PCB Design Engineer, Design Science Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD10-Susy Webb
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD11: Reliability of Electronics - Role of Intermetallic Compounds Instructor: Dr. Jennie Hwang, President, H-Technologies Group Seminar Type: Professional Development Track: Quality, Reliability, Assembly, Test and Inspection Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD11-Jennie Hwang
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD13: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly), DFF (Design for Printed Board Fabrication) and More - Part II Instructor: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD13-Dale Lee