Agenda Planner - Programs

Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD01: Reflow Soldering Process and Influence on Defects " An In-Depth Look Instructor: Dr. S. Manian Ramkumar, Dean of the College of Engineering Technology, Rochester Institute of Technology (RIT) Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD01-S. Manian Ramkumar
Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD02: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World Instructor: Ray Prasad, President, Ray Prasad Consultancy Group Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD02_Ray Prasad
Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD03: Designing with HDI Technology Instructor: Susy Webb, SR PCB Design Engineer, Design Science Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD03_Susy Webb
Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD04: Preventing Manufacturing Defects and Product Failure Instructor: Dr. Jennie Hwang, President, H-Technologies Group Seminar Type: Professional Development Track: Quality, Reliability, Assembly, Test and Inspection Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD04-Jennie Hwang
Mon, Mar 8, 2021 - 9:00 AM to 12:00 PM PD06: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly), DFF (Design for Printed Board Fabrication) and More - Part I Instructor: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD06_DaleLee
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD08: Stencil Printing Process and Solder Paste Inspection " An In-Depth Look Dr. S. Manian Ramkumar, Dean of the College of Engineering Technology, Rochester Institute of Technology (RIT) Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD08-S. Manian Ramkumar
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD09: Power Electronics in Manufacturing: Operations and Application Instructor: Brian Zahnstecher, Principal, PowerRox Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD09-Brian Zahnstecher
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD10: Mentoring Extended PCB Design Techniques Instructor: Susy Webb, SR PCB Design Engineer, Design Science Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD10-Susy Webb
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD11: Reliability of Electronics - Role of Intermetallic Compounds Instructor: Dr. Jennie Hwang, President, H-Technologies Group Seminar Type: Professional Development Track: Quality, Reliability, Assembly, Test and Inspection Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD11-Jennie Hwang
Mon, Mar 8, 2021 - 2:00 PM to 5:00 PM PD13: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly), DFF (Design for Printed Board Fabrication) and More - Part II Instructor: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD13-Dale Lee
Tue, Mar 9, 2021 - 9:00 AM to 12:00 PM PD15: PCB Quality Metrics that Drive Reliability Instructor: Dr. Bhanu Sood, Commodity Risk Assessment Engineer, NASA Goddard Space Flight Center Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD15-Bhanu Sood
Tue, Mar 9, 2021 - 9:00 AM to 12:00 PM PD16: A Beginner's Guide to RF and Microwave PCB Design and Prototyping Part I Instructor: Benjamin Jordan, Sr. Product Manager, Fusion 360 Electronics Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD16-Ben Jordan
Tue, Mar 9, 2021 - 9:00 AM to 12:00 PM PD17: PCB problem solving- PCB 102 - Part I Instructor: Paul Cooke, Field Application Engineering Manager, AGC NELCO AMERICA INC Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Advanced - detailed content, high-level discussion Download Presentation_PD17-Paul Cooke
Tue, Mar 9, 2021 - 9:00 AM to 12:00 PM PD18: PCB Designers Guide for Flexible and Rigid Flex Circuits- Planning, Design, Fabrication and Assembly Process Principles Instructor: Vern Solberg, Solberg Technical Consulting Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD18-Vern Solberg
Tue, Mar 9, 2021 - 9:00 AM to 12:00 PM PD19: Lead-Free Wave Soldering & Process Troubleshooting - Failures Causes & Cures - Part I Instructor: Bob Willis, Bobwillis.co.uk Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD19 and PD24_Bob Willis
Tue, Mar 9, 2021 - 2:00 PM to 5:00 PM PD21: A Beginner's Guide to RF and Microwave PCB Design and Prototyping - Part II Instructor: Benjamin Jordan, Sr. Product Manager, Fusion 360 Electronics Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD21-Ben Jordan
Tue, Mar 9, 2021 - 2:00 PM to 5:00 PM PD22: PCB problem solving- PCB 102 - Part II Instructor: Paul Cooke, Field Application Engineering Manager, AGC NELCO AMERICA INC Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Advanced - detailed content, high-level discussion Download Presentation_PD22-Paul Cooke
Tue, Mar 9, 2021 - 2:00 PM to 5:00 PM PD23: PCB Designers Guide for Implementing Advanced Semiconductor Package Technologies- Flip-Chip, WLP, FOWLP, 2D, 2.5D and 3D Instructor: Vern Solberg, Solberg Technical Consulting Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD23-Vern Solberg
Tue, Mar 9, 2021 - 2:00 PM to 5:00 PM PD24: Lead-Free Wave Soldering & Process Troubleshooting - Failures Causes & Cures - Part II Instructor: Bob Willis, Bobwillis.co.uk Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD19 and PD24_Bob Willis
Thu, Mar 11, 2021 - 9:00 AM to 12:00 PM PD05: Role and Selection Criteria of Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies Instructor: Kunal Shah, Ph.D., President, LiloTree Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD05-Kunal Shah - Updated
Thu, Mar 11, 2021 - 9:00 AM to 12:00 PM PD07: Low Temperature Soldering, Assembly, Inspection & Defects - Causes & Cures - Part I Instructor: Bob Willis, Bobwillis.co.uk Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD07 and PD14_Bob Willis
Thu, Mar 11, 2021 - 9:00 AM to 12:00 PM PD25: J-STD-001 Section 8 Objective Data " Where Do I Start? Instructor: Douglas Pauls, Principal Materials and Process Engineer, Collins Aerospace Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD25-Doug Pauls - Updated
Thu, Mar 11, 2021 - 9:00 AM to 12:00 PM PD26: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of Board Talk - Part I Instructor: Phil Zarrow, President and Principal Consultant, ITM Consulting Instructor: Jim Hall, Principal SMT Consultant, ITM Consulting Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD26-Phill Zarrow and Jim Hall
Thu, Mar 11, 2021 - 9:00 AM to 12:00 PM PD27: Measurement System Analysis for Electronics Assemblies - Part I Instructor: Jose Servin, SMT and Materials Expert, Continental - Vitesco Seminar Type: Professional Development Track: Quality, Reliability, Assembly, Test and Inspection Level: Basic - broad foundation Download Presentation_PD27-Jose Servin
Thu, Mar 11, 2021 - 2:00 PM to 5:00 PM PD12: PCB Fabrication Basics: Process and Specification Instructor: Jim Vanden Hogen, Sr. PCB Designer, San Diego PCB Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Basic - broad foundation Download Presentation_PD12-Jim Vanden Hogen
Thu, Mar 11, 2021 - 2:00 PM to 5:00 PM PD14: Low Temperature Soldering, Assembly, Inspection & Defects - Causes & Cures - Part II Instructor: Bob Willis, Bobwillis.co.uk Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD07 and PD14_Bob Willis
Thu, Mar 11, 2021 - 2:00 PM to 5:00 PM PD28: Designing Reliable Electronics in Accordance with IPC-J-STD-001 Section 8 Cleanliness Instructor: Mike Bixenman, DBA, Chief Technology Officer (CTO) and Co-founder, Magnalytix, LLC Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD28-Mike Bixenmann
Thu, Mar 11, 2021 - 2:00 PM to 5:00 PM PD29: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of Board Talk - Part II Instructor: Phil Zarrow, President and Principal Consultant, ITM Consulting Instructor: Jim Hall, Principal SMT Consultant, ITM Consulting Seminar Type: Professional Development Track: Assembly Processes Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD29-Phill Zarrow and Jim Hall
Thu, Mar 11, 2021 - 2:00 PM to 5:00 PM PD30: Measurement System Analysis for Electronics Assemblies - Part II Instructor: Jose Servin, SMT and Materials Expert, Continental - Vitesco Seminar Type: Professional Development Track: Quality, Reliability, Assembly, Test and Inspection Level: Basic - broad foundation Download Presentation_PD30-Jose Servin - Updated