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Date
Mon, Mar 8th, 2021
Tue, Mar 9th, 2021
Wed, Mar 10th, 2021
Thu, Mar 11th, 2021
Fri, Mar 12th, 2021
Type
Management
Special Event
Technical Conference Session
Professional Development
Exhibitor Presentations
Track
Assembly Processes
Circuit Design and Component Technologies
Electronic Materials
Enabling Future Technologies
Factory of the Future Implementation
Meeting Extreme Requirements
PCB Fabrication and Materials
Quality, Reliability, Assembly, Test and Inspection
Speaker
Aaron Birney, IPC International, Inc.
Alex Stepinski, GreenSource Fabrication
Anaya Vardya, American Standard Circuit, Inc.
Benjamin Jordan, Fusion 360 Electronics
Beverley Christian, HDP User Group
Bob Willis, Bobwillis.co.uk
Brad Bourne, FTG Corporation
Brian Zahnstecher, PowerRox
Brittney Nelson, Cisco
Chaim Lubin, Lincoln International
Charlene Gunter du Plessis, IPC International, Inc.
Cheryl Van Dyke, General Dynamics Mission Systems
Chris Mitchell, IPC International, Inc.
Chris Peters, U.S. Partnership for Assured Electronics
Christina Trussell
Dale Lee, Plexus Corporation
Daniel Heitner
David Patterson, Cirtronics Corporation
Dennis Fritz, Fritz Technology Consulting
Diane Maceri, Schweitzer Engineering Laboratories, Inc.
Douglas Pauls, Collins Aerospace
Dr. Bhanu Sood, NASA Goddard Space Flight Center
Dr. Jennie Hwang, H-Technologies Group
Dr. Milea Kammer, Honeywell Aerospace
Dr. S. Manian Ramkumar, Rochester Institute of Technology (RIT)
Frank McShane, Arrow Electronics, Inc.
Gene Weiner
Harald Ahnert, Atotech Group
Jack Calderon, Lincoln International
Jason Keeping, Celestica International L.P.
Jeff Leblanc, Vicor Corporation
Jessi Hall, Schweitzer Engineering Laboratories, Inc.
Jim Hall, ITM Consulting
Jim Vanden Hogen, San Diego PCB
Joe O'Neil, Green Circuits
John Mitchell, IPC International, Inc.
Jonathan Rowntree, Rogers Corporation
Jose Servin, Continental - Vitesco
Julie Silk, Keysight Technologies
Katherine Ducharme, General Dynamics Missions Systems
Kunal Shah, Ph.D., LiloTree
Mark Warner, Arrow Electronics, Inc.
Mark Wolfe
Martin Goetz, Northrop Grumman
Matt Kelly, IPC International, Inc.
Michael Carano, RBP Chemical Technology, Inc.
Michael Ford, Aegis Software
Michael Hayes, Tyndall
Michelle Farrington, Advanced Functional Fabrics of America (AFFOA)
Mike Bixenman, DBA, Magnalytix, LLC
Milos Lazic, Indium
Murdoch Fitzgerald, Arrow Electronics, Inc.
Naim Kapadia, The Manufacturing Technology Centre
Norman Weiss, German Industry 4.0 Campus
Paige Fiet
Paul Cooke, AGC NELCO AMERICA INC
Phil Zarrow, ITM Consulting
Radu Diaconescu, Swissmic
Ray Prasad, Ray Prasad Consultancy Group
Russell Nowland, Nokia
Sarah Czap, IBM
Sarah Czaplewski, IBM
Sebastian Schaal, Luminovo GmbH
Shawn DuBravac Ph.D., CFA, IPC International, Inc.
Stan Rak, Continental Automotive Systems
Steve Pudles, Zentech Manufacturing Inc.
Susy Webb, Design Science
Tim Burke PhD, Arch Systems
Travis M. Hessman, IndustryWeek
Udo Welzel, Robert Bosch GmbH
Urmi Ray, iNEMI
Vern Solberg, Solberg Technical Consulting
Weifeng Liu, Flex
Level
Advanced - detailed content, high-level discussion
Basic - broad foundation
Intermediate - student should have some knowledge of the topic
Programs: 121 - 121 of 121
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Fri, Mar 12, 2021 - 12:30 PM to 2:00 PM
Build Your Future APEX EXPO Career Panel
Moderator: John Mitchell, IPC President and CEO, IPC International, Inc.
Speaker: Joe O'Neil, CEO, Green Circuits
Speaker: Sarah Czaplewski, IBM
Speaker: Steve Pudles, President and CEO, Zentech Manufacturing Inc.
Speaker: Brittney Nelson, Electrical Product Engineer, Cisco
Speaker: Daniel Heitner
Speaker: Paige Fiet
Speaker: Christina Trussell
Speaker: Sarah Czap, IBM
Seminar Type: Special Event
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