Agenda Planner - Programs

Tue, Mar 9, 2021 - 11:00 AM to 11:30 AM Exhibitor Product Presentation - Omron AXI: Omron 3D CT X-Ray Technology Demonstration Virtual Room 7 - Login to the virtual plaform here: https://www.ipc-apex-event.com/ Seminar Type: Exhibitor Presentations
Tue, Mar 9, 2021 - 11:00 AM to 11:30 AM Exhibitor Product Presentation - Taiyo-America, Inc. New Solder Mask Innovations That Solve Current Industry Concerns Virtual Room 6 - Login to the virtual plaform here: https://www.ipc-apex-event.com/ Seminar Type: Exhibitor Presentations
Tue, Mar 9, 2021 - 11:30 AM to 12:00 PM Exhibitor Product Presentation - Panasonic Smart Manufacturing Virtual Room 6 - Login to the virtual plaform here: https://www.ipc-apex-event.com/ Seminar Type: Exhibitor Presentations
Tue, Mar 9, 2021 - 12:30 PM to 1:30 PM IPC Annual Meeting & Awards Ceremony Seminar Type: Special Event
Tue, Mar 9, 2021 - 12:30 PM to 1:30 PM Virtual Escape Experience Seminar Type: Special Event
Tue, Mar 9, 2021 - 2:00 PM to 2:30 PM Exhibitor Product Presentation - Omron AOI: Omron 3D AOI Technology Demonstration Virtual Room 6 - Login to the virtual plaform here: https://www.ipc-apex-event.com/ Seminar Type: Exhibitor Presentations
Tue, Mar 9, 2021 - 2:00 PM to 2:30 PM Exhibitor Product Presentation - Orbotech, Inc. Orbotech PCB Product Portfolio Session Virtual Room 7 - Login to the virtual plaform here: https://www.ipc-apex-event.com/ Seminar Type: Exhibitor Presentations
Tue, Mar 9, 2021 - 2:00 PM to 5:00 PM PD21: A Beginner's Guide to RF and Microwave PCB Design and Prototyping - Part II Instructor: Benjamin Jordan, Sr. Product Manager, Fusion 360 Electronics Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD21-Ben Jordan
Tue, Mar 9, 2021 - 2:00 PM to 5:00 PM PD22: PCB problem solving- PCB 102 - Part II Instructor: Paul Cooke, Field Application Engineering Manager, AGC NELCO AMERICA INC Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Advanced - detailed content, high-level discussion Download Presentation_PD22-Paul Cooke
Tue, Mar 9, 2021 - 2:00 PM to 5:00 PM PD23: PCB Designers Guide for Implementing Advanced Semiconductor Package Technologies- Flip-Chip, WLP, FOWLP, 2D, 2.5D and 3D Instructor: Vern Solberg, Solberg Technical Consulting Seminar Type: Professional Development Track: Circuit Design and Component Technologies Level: Intermediate - student should have some knowledge of the topic Download Presentation_PD23-Vern Solberg