AIT has a proud history of providing leading edge solutions in electronic packaging with the use of advanced materials. With the pioneering use of molecular flexible epoxy adhesives for die and substrate attaches in the 1980s, the benefits of using compliant and non-silicone adhesives have been proven with more than 25 years of outstanding reliability. The use of flexible epoxy adhesive film and paste adhesives for handling large bonding areas is now the accepted golden rule in managing inter-facial stresses to enhance long-term semiconductor device reliability. (less)