Agenda Planner - Programs

Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S05: Low Temperature Alloys I Presenter/Committee Chair: Beverley Christian, HDP User Group Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Location: 6D S05: Low Temperature Alloys I
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S01: Dispensing/Jetting Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation Seminar Type: Technical Conference Session Track: Printed Electronics Location: ROOM 2 S01: Dispensing/Jetting
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S02: PCB Fabrication/Plating I Speaker: Julie Silk, Reliability Program Manager, Keysight Technologies Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Location: 6C S02: PCB Fabrication/Plating I
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S03: Assembly/Inspection (BTC/ BGA) Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Location: ROOM 1A S03: Assembly/Inspection (BTC/ BGA)
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S04: Test/Inspection I Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Location: 1B S04: Test/Inspection I
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S10: PCB Surface Finishes I Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Location: 6D S10: PCB Surface Finishes I
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S06: Printed Electronics I Presenter/Committee Chair: Stanton Rak, Head of Materials Technology, Continental Automotive Speaker: Woonhong Yeo, Georgia Institute of Technology Presenter/Committee Chair: Benjamin Leever, Advanced Development Team Leader, Air Force Research Laboratory Seminar Type: Technical Conference Session Track: Printed Electronics Track Location: ROOM 2 S06: Printed Electronics I
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S07: PCB/Microvia Reliability Jeff Schake, Senior Engineer, ASM Assembly Systems Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track Location: 6C S07: PCB/Microvia Reliability
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S09: Test/Inspection II Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 2 Location: 1B S09: Test/Inspection II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S12: Printed Electronics II Presenter/Committee Chair: Weifeng Liu, Flextronics International Seminar Type: Technical Conference Session Track: Printed Electronics Track Location: 6D S12: Printed Electronics II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S13: PCB Fabrication and Plating II Speaker: Stanton Rak, Head of Materials Technology, Continental Automotive Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track Location: 6C S13: PCB Fabrication and Plating II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S14: Low Temperature Alloys II Presenter/Committee Chair: Milos Lazic, Indium Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: ROOM 1A S14: Low Temperature Alloys II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S15: Adhesives/Silicone Greases Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 2 Location: ROOM 2 S15: Adhesives/Silicone Greases
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Design Location: 1B S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM S20: Cleaning Speaker: Denis Jean, Kester Seminar Type: Technical Conference Session Track: Cleaning Location: ROOM 1B S20: Cleaning
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM S18: Reliability / Embedded Components/ Power Electronics/ Thermal Modelling/ Mechanical Shock Testing Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc. Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track S18: Reliability / Embedded Components/ Power Electronics/ Thermal Modelling/ Mechanical Shock Testi
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM S19: Solder Paste/ Reliability II Presenter/Committee Chair: Milos Lazic, Indium Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: ROOM 1A S19: Solder Paste/ Reliability II
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM S21: High Speed/High Frequency Laminate Materials Used in Design Speaker: David Hoover, Sr Field Application Engineer, TTM Technologies Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Location: ROOM 2 S21: High Speed/High Frequency Laminate Materials Used in Design
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM S22: Printed Electronics IV Presenter/Committee Chair: Benjamin Leever, Advanced Development Team Leader, Air Force Research Laboratory Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track Location: D S22: Printed Electronics IV
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM S23: PCB Surface Finishes II Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch Co. Ltd. Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: ROOM 1A S23: PCB Surface Finishes II
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM S24: Solder Paste/ Reliability III Presenter/Committee Chair: Stanton Rak, Head of Materials Technology, Continental Automotive Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 2 Location: ROOM 2 S24: Solder Paste/ Reliability III
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM S25: Failure Analysis Presenter/Committee Chair: Beverley Christian, HDP User Group Seminar Type: Technical Conference Session Track: Manufacturing Software Location: C S25: Failure Analysis
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM S26: Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Location: ROOM 1B S26: Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM S27: High Speed/High Frequency I Presenter/Committee Chair: David Hoover, Sr Field Application Engineer, TTM Technologies Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track Location: D S27: High Speed/High Frequency I
Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM S28: Environmental Presenter/Committee Chair: Julie Silk, Reliability Program Manager, Keysight Technologies Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: C S28: Environmental
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM S35: Smart Manufacturing/ Industry 4.0/ Software Manufacturing Tools Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC Seminar Type: Technical Conference Session Track: Manufacturing Software Track Location: ROOM 1B S35: Smart Manufacturing/ Industry 4.0/ Software Manufacturing Tools
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM S33: Conformal Coating Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: D S33: Conformal Coating
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM S34: Assembly/Emerging Technologies Presenter/Committee Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 6C S34: Assembly/Emerging Technologies
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM S36: Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Location: ROOM 1A S36: Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion