Jan 26, 2019 - Jan 31, 2019
San Diego Convention Center
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S13: PCB Fabrication and Plating II
Speaker: Stanton Rak, Head of Materials Technology, Continental Automotive
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: 6C
S13: PCB Fabrication and Plating II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S14: Low Temperature Alloys II
Presenter/Committee Chair: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
S14: Low Temperature Alloys II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S15: Adhesives/Silicone Greases
Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 2
Location: ROOM 2
S15: Adhesives/Silicone Greases
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly
Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3 Design
Location: 1B
S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
S20: Cleaning
Speaker: Denis Jean, Kester
Seminar Type: Technical Conference Session
Track: Cleaning
Location: ROOM 1B
S20: Cleaning
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
S18: Reliability / Embedded Components/ Power Electronics/ Thermal Modelling/ Mechanical Shock Testing
Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
S18: Reliability / Embedded Components/ Power Electronics/ Thermal Modelling/ Mechanical Shock Testi
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
S19: Solder Paste/ Reliability II
Presenter/Committee Chair: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
S19: Solder Paste/ Reliability II
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
S21: High Speed/High Frequency Laminate Materials Used in Design
Speaker: David Hoover, Sr Field Application Engineer, TTM Technologies
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: ROOM 2
S21: High Speed/High Frequency Laminate Materials Used in Design
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
S22: Printed Electronics IV
Presenter/Committee Chair: Benjamin Leever, Advanced Development Team Leader, Air Force Research Laboratory
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: D
S22: Printed Electronics IV
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
S23: PCB Surface Finishes II
Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch Co. Ltd.
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
S23: PCB Surface Finishes II