Jan 26, 2019 - Jan 31, 2019
San Diego Convention Center
Sat, Jan 26, 2019 - 8:00 AM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 15A
Sun, Jan 27, 2019 - 8:00 AM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Sun, Jan 27, 2019 - 8:00 AM to 4:30 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Circuit Boards
Location: 6F
Sun, Jan 27, 2019 - 9:00 AM to 4:00 PM
Seminar Type: Standard Development Committee
General Committee: Printed Electronics
Location: 14B
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Basic - broad foundation
Location: Room 6C
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6D
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Basic - broad foundation
Location: Room 3
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Advanced - detailed content, high-level discussion
Location: Room 2
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Cleaning/Coating/Contamination
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1A
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Supply Chain/Business Issues
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6C
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Basic - broad foundation
Location: Room 6D
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1A
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Advanced - detailed content, high-level discussion
Location: Room 2
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
Sun, Jan 27, 2019 - 3:00 PM to 4:30 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Assembly and Joining
Location: 14A
Sun, Jan 27, 2019 - 4:00 PM to 6:00 PM
Seminar Type: Standard Development Committee
Location: 15A
Sun, Jan 27, 2019 - 6:00 PM to 7:00 PM
Seminar Type: Special Event
Location: West Terrace
Mon, Jan 28, 2019 - 7:30 AM to 5:00 PM
Seminar Type: Management
Track: Management
Location: 5A
Mon, Jan 28, 2019 - 7:30 AM to 5:00 PM
Seminar Type: Management
Track: Management
Location: 4
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Location: 17B
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
General Committee: Electronic Product Data Description
Location: 17A
Mon, Jan 28, 2019 - 8:00 AM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 6F
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 8
Mon, Jan 28, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 14A
Mon, Jan 28, 2019 - 8:00 AM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Mon, Jan 28, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 9
Mon, Jan 28, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 10
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 14B
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 11B
Mon, Jan 28, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Test
General Committee: Rigid Printed Circuit Boards
Location: 7A
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 16B
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6C
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6D
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1A
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Design
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Intermediate - student should have some knowledge of the topic
Location: Room 2
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Design
Level: Intermediate - student should have some knowledge of the topic
Location: Room 3
Mon, Jan 28, 2019 - 10:15 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 10
Mon, Jan 28, 2019 - 10:15 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Test
General Committee: Testing
Location: 14A
Mon, Jan 28, 2019 - 10:15 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Rigid Printed Circuit Boards
Location: 7A
Mon, Jan 28, 2019 - 12:00 PM to 1:30 PM
Seminar Type: Special Event
Location: 6A
Mon, Jan 28, 2019 - 12:00 PM to 1:30 PM
Seminar Type: Standard Development Committee
Location: 11A
Mon, Jan 28, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 17B
Mon, Jan 28, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Printed Board Design Technology
Location: 7A
Mon, Jan 28, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials and Design
General Committee: Printed Board Design Technology
Location: 14B
Mon, Jan 28, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 16B
Mon, Jan 28, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 8
Mon, Jan 28, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 10
Mon, Jan 28, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Boards
Location: 17A
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6C
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6D
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Basic - broad foundation
Location: Room 1A
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 3
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Intermediate - student should have some knowledge of the topic
Location: Room 2
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 8
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 10
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 9
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Packaged Electronic Components
Location: 12
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Rigid Printed Circuit Boards
Location: 14A
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Mon, Jan 28, 2019 - 5:00 PM to 6:00 PM
Seminar Type: Special Event
Location: 7B
Mon, Jan 28, 2019 - 5:00 PM to 6:30 PM
Seminar Type: Standard Development Committee
Location: 15A
Mon, Jan 28, 2019 - 5:30 PM to 6:30 PM
Seminar Type: Special Event
Location: West Terrace
Mon, Jan 28, 2019 - 6:00 PM to 9:00 PM
Seminar Type: Management
Location: Searsuckers
Tue, Jan 29, 2019 - 7:00 AM to 8:00 AM
Seminar Type: Management
Location: 8
Tue, Jan 29, 2019 - 7:30 AM to 8:30 AM
Seminar Type: Special Event
Location: Room 3
Tue, Jan 29, 2019 - 8:30 AM to 9:30 AM
Seminar Type: Special Event
Location: 6A
Tue, Jan 29, 2019 - 9:45 AM to 10:00 AM
Seminar Type: Special Event
Location: Lobby D
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Location: 17B
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Terms and Definitions
Location: 14B
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Production Design and Development
General Committee: Electronic Documentation Technology
Location: 6E
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 10
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 9
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Tue, Jan 29, 2019 - 10:00 AM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 14A
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: High Spped/High Frequency Interconnections
Location: 16B
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Special Event
Location: 5A
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Assembly and Joining
Location: 12
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Location: 7A
Tue, Jan 29, 2019 - 12:00 PM to 1:30 PM
Seminar Type: Special Event
Location: 6A
Tue, Jan 29, 2019 - 1:00 PM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 11B
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 17A
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability
Location: 6D
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Buzz Session
Location: Room 4
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Design
General Committee: Printed Board Design Technology
Location: 9
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 6F
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
General Committee: Electric Product Data Description
Location: 8
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Environment, Health & Saftey (EHS)
Location: 10
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 12
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 15A
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Process Control
Location: 7A
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
General Committee: Assembly and Joining
Location: 17B
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: High Spped/High Frequency Interconnections
Location: 16B
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Printed Board Design Technology
Location: 14B
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Emerging Technologies
General Committee: Embedded Devices
Location: 6E
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Technical Conference Session
Track: Printed Electronics
Location: ROOM 2
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability
Location: 6C
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability
Location: ROOM 1A
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability
Location: 1B
Tue, Jan 29, 2019 - 2:00 PM to 4:00 PM
Seminar Type: Special Event
Location: 5
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Base Materials
Location: 10
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 7A
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 12
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Product Reliability
Location: 17A
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 15A
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: High Spped/High Frequency Interconnections
Location: 16B
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 11A
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM
Seminar Type: Buzz Session
Location: Room 4
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: 6D
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM
Seminar Type: Technical Conference Session
Track: Printed Electronics Track
Location: ROOM 2
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: 6C
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 2
Location: 1B
Tue, Jan 29, 2019 - 5:00 PM to 6:00 PM
Seminar Type: Special Event
Wed, Jan 30, 2019 - 7:30 AM to 8:30 AM
Seminar Type: Special Event
Location: Room 3
Wed, Jan 30, 2019 - 7:30 AM to 9:00 AM
Seminar Type: Standard Development Committee
Track: PCB Fabrication, Materials and Design
General Committee: Electronic Product Data Description
Location: 10
Wed, Jan 30, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 8
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 17A
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 7A
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11A
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 9
Wed, Jan 30, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Location: 17B
Wed, Jan 30, 2019 - 8:00 AM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 15A
Wed, Jan 30, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Design
General Committee: Product Assurance
Location: 16B
Wed, Jan 30, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Product Assurance
Location: 14A
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 12
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: High Spped/High Frequency Interconnections
Location: 14B
Wed, Jan 30, 2019 - 9:00 AM to 10:00 AM
Seminar Type: Buzz Session
Location: Room 5A
Wed, Jan 30, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials and Design
General Committee: Electronic Product Data Description
Location: 10
Wed, Jan 30, 2019 - 10:00 AM to 10:30 PM
Seminar Type: Poster
Location: A
Wed, Jan 30, 2019 - 10:00 AM to 6:00 PM
Seminar Type: Management
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM
Seminar Type: Standard Development Committee
Location: 11A
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Fabrication Processes
Location: 7A
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Wed, Jan 30, 2019 - 10:15 AM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 9
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 12
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Buzz Session
Location: Room 4
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Technical Conference Session
Track: Printed Electronics Track
Location: 6D
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: 6C
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 2
Location: ROOM 2
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3 Design
Location: 1B
Wed, Jan 30, 2019 - 12:00 PM to 1:30 PM
Seminar Type: Special Event
Location: 6A
Wed, Jan 30, 2019 - 12:00 PM to 1:00 PM
Seminar Type: Standard Development Committee
Location: 17A
Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 7A
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Technical Conference Session
Track: Cleaning
Location: ROOM 1B
Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 6E
Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 14A
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 8
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Test
General Committee: Testing
Location: 12
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: High Spped/High Frequency Interconnections
Location: 11B
Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM
Seminar Type: Standard Development Committee
General Committee: Printed Electronics
Location: 16B
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: ROOM 2
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Seminar Type: Standard Development Committee
Location: 17B
Wed, Jan 30, 2019 - 2:30 PM to 3:30 PM
Seminar Type: Special Event
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 8
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Supply Chain/Business Issues
General Committee: Managemnet
Location: 11A
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Packaged Electronic Components
Location: 12
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 17B
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: High Spped/High Frequency Interconnections
Location: 17A
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Management
Track: PCB Fabrication and Materials
Location: 11B
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 11B
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
Seminar Type: Buzz Session
Location: Room 4
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: D
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 2
Location: ROOM 2
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
Seminar Type: Technical Conference Session
Track: Manufacturing Software
Location: C
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: ROOM 1B
Wed, Jan 30, 2019 - 4:00 PM to 4:30 PM
Seminar Type: Special Event
Location: Sails Pavilion
Wed, Jan 30, 2019 - 5:30 PM to 7:00 PM
Seminar Type: Standard Development Committee
Location: 17B
Wed, Jan 30, 2019 - 6:00 PM to 7:00 PM
Seminar Type: Special Event
Location: 5A
Wed, Jan 30, 2019 - 6:30 PM to 8:00 PM
Seminar Type: Special Event
Location: Room 4
Thu, Jan 31, 2019 - 7:30 AM to 8:30 AM
Seminar Type: Special Event
Location: Room 3
Thu, Jan 31, 2019 - 8:00 AM to 2:00 PM
Seminar Type: Buzz Session
Location: Room 4
Thu, Jan 31, 2019 - 8:00 AM to 12:00 PM
Seminar Type: Standard Development Committee
Location: 17A
Thu, Jan 31, 2019 - 8:00 AM to 2:00 PM
Seminar Type: Standard Development Committee
Location: 6F
Thu, Jan 31, 2019 - 8:00 AM to 10:00 AM
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Base Materials
Location: 14A
Thu, Jan 31, 2019 - 8:00 AM to 5:00 PM
Seminar Type: Standard Development Committee
General Committee: Product Assurance
Location: 15A
Thu, Jan 31, 2019 - 8:00 AM to 5:00 PM
Seminar Type: Standard Development Committee
Location: 12
Thu, Jan 31, 2019 - 8:00 AM to 9:00 AM
Seminar Type: Standard Development Committee
General Committee: Managemnet
Location: 16B
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate - student should have some knowledge of the topic
Location: Room 11B
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Basic - broad foundation
Location: Room 11A
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Design
Level: Intermediate - student should have some knowledge of the topic
Location: Room 10
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 9
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 8
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate - student should have some knowledge of the topic
Location: Room 7B
Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: D
Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: C
Thu, Jan 31, 2019 - 10:00 AM to 11:00 AM
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
Location: 14A
Thu, Jan 31, 2019 - 10:00 AM to 2:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Testing
Location: 16B
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Technical Conference Session
Track: Manufacturing Software Track
Location: ROOM 1B
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: D
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Technical Conference Session
Track: Cleaning/Coating/Contamination
Location: 6C
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: ROOM 1A
Thu, Jan 31, 2019 - 1:00 PM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14B