Jan 26, 2019 - Jan 31, 2019
San Diego Convention Center
Sat, Jan 26, 2019 - 8:00 AM to 5:00 PM
7-31B: IPC-A-610 Task Group
Presenter/Committee Chair: Robert Fornefeld, L3 Communications
Presenter/Committee Chair: Mary Muller
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 15A
Sun, Jan 27, 2019 - 8:00 AM to 3:00 PM
5-22A: J-STD-001 Task Group
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Sun, Jan 27, 2019 - 8:00 AM to 4:30 PM
7-31A/D-33A: Joint Meeting - IPC-A-600 and IPC-6012 Task Groups
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Circuit Boards
Location: 6F
Sun, Jan 27, 2019 - 9:00 AM to 4:00 PM
D-64: Printed Electronics Final Assembly Subcommittee - A-team
Presenter/Committee Chair: Michael Jawitz, Northrop Grumman Corporation
Presenter/Committee Chair: Jeff Shubrooks, Raytheon Company
Seminar Type: Standard Development Committee
General Committee: Printed Electronics
Location: 14B
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD01: Non Contact Additive Technologies in Contemporary Electronics Production and Related Fields
Presenter/Committee Chair: Gustaf Martensson, Ph.D., Expert Complex Fluids, Mycronic AB / KTH
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Basic - broad foundation
Location: Room 6C
PD01 Presentation - Gustaf Martensson
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD02: SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 1
Presenter/Committee Chair: S. Manian Ramkumar, Ph.D., Interim Dean, Rochester Institute of Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6D
PD02 Presentation - Dr. S. Manian Ramkumar
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD03: PCB Fabrication Basics: Process and Specification
Presenter/Committee Chair: Jim Vanden Hogen, PCB Designer, San Diego PCB
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Basic - broad foundation
Location: Room 3
PD03 Presentation - Jim Vanden Hogen
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD04: Advanced Rework: Hands-on BGA Reballing and Leadless Devices - Part 1
Presenter/Committee Chair: James Barnhart, Master Instructor/Course Developer, BEST Inc
Presenter/Committee Chair: Norman Mier Jr., Senior Technical Trainer, BEST Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Advanced - detailed content, high-level discussion
Location: Room 2
PD04 Presentation - Mier and Barnhart
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD05: Flip Chip, WLCSP, and FOWLP Assembly and Reliability
Presenter/Committee Chair: John Lau, Ph.D., Sr. Technical Advisor, ASM Assembly Materials Ltd.
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
PD05 Presentation - John Lau
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD06: J-STD-001 and Ionic Residue Testing
Presenter/Committee Chair: Douglas Pauls, Principle Materials and Process Engineer, Rockwell Collins
Seminar Type: Professional Development
Track: Cleaning/Coating/Contamination
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1A
PD06 Presentation - Doug Pauls
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
PD07: Contracting with the Customer: What the EMS Manager and Executive Needs to Know
Presenter/Committee Chair: Jeffrey Roth, Attorney, F&B Law Firm, P.C.
Seminar Type: Professional Development
Track: Supply Chain/Business Issues
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6C
PD07 Presentation - Roth and Anderson
PD07_534028
PD07_ems-oem-ordering-agreemen t
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
PD08: SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 2
Presenter/Committee Chair: S. Manian Ramkumar, Ph.D., Interim Dean, Rochester Institute of Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Basic - broad foundation
Location: Room 6D
PD08 Presentation - Manian Ramkumar
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
PD09: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1A
PD09 Presentation - Ray Prasad
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
PD10: Advanced Rework: Hands-on BGA Reballing and Leadless Devices - Part 2
Presenter/Committee Chair: James Barnhart, Master Instructor/Course Developer, BEST Inc
Presenter/Committee Chair: Norman Mier Jr., Senior Technical Trainer, BEST Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Advanced - detailed content, high-level discussion
Location: Room 2
PD10 Presentation - Mier and Barnhart
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
PD12: Selection of Materials and Processes for High Reliability Assemblies
Presenter/Committee Chair: Barrie Dunn, Honorary Professor, University of Portsmouth
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
PD12 Presentation - Berrie Dunn
Sun, Jan 27, 2019 - 3:00 PM to 4:30 PM
5-20/7-30: Assembly & Joining Committee - By Invitation Only
Presenter/Committee Chair: Robert Cooke, NASA Johnson Space Center
Presenter/Committee Chair: Leo Lambert, EPTAC Corporation
Presenter/Committee Chair: Daniel Foster, Missile Defense Agency
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Assembly and Joining
Location: 14A
Sun, Jan 27, 2019 - 4:00 PM to 6:00 PM
Committee Chairman Council (By Invitation)
Seminar Type: Standard Development Committee
Location: 15A
Sun, Jan 27, 2019 - 6:00 PM to 7:00 PM
IPC Committee Chairmen's Reception(By Invitation )
Seminar Type: Special Event
Location: West Terrace
Mon, Jan 28, 2019 - 7:30 AM to 5:00 PM
EMS Management Meeting
Speaker: Jeffrey Roth, Attorney, F&B Law Firm, P.C.
Speaker: Steve Ulm, Senior Director of Business Marketing, Vishay
Speaker: John Caltabiano, Vice President of Global Supply Chain, Jabil
Speaker: Jack Calderon, Managing Director, Lincoln International
Speaker: Neil Hamlett, IBM Watson
Speaker: Chaim Lubin, Managing Director, Lincoln International
Speaker: Olaf Korn, Arrow Electronics
Seminar Type: Management
Track: Management
Location: 5A
AI-IBM Watson - Hamlett Presentation
Arrow-Korn Presentation
Global Trade Outlook - Mitchell Presentation
IPC Education Foundation Presentation
IPC Market Research Update
Jabil - Caltabiano Presentation
Lincoln Partners Presentation
Vishay - Ulm Presentation
EMS Participant Roster
EMS Customer Contracts - Roth Presentation
Mon, Jan 28, 2019 - 7:30 AM to 5:00 PM
IPC Hall of Fame Council Management Meeting: EXECUTIVE FORUM ON AUTOMOTIVE ELECTRONICS
Speaker: Bob Neves, Chairman/CTO Microtek Labs China and IPC Board of Directors
Speaker: Randy Hierbaum, VP of Sales, Optimal+
Speaker: Larry Wilson III, Global Electronics Cost Manager, Nexteer Automotive
Speaker: Carlo Favini, Founder, Elga Europe
Speaker: Joe D'Ambrisi, Global Vice President Electronics Marketing Technology, MacDermid Alpha Electronics Solutions
Speaker: Dwight Howard, APTIV
Speaker: Alun Morgan, Ventec Ambassador, Ventec
Speaker: Alexander Stepinski, Vice President, GreenSource Fabrication, LLC, Whelen Engineering Company, Inc.
Speaker: Don Cullen, Director of Marketing Communications, MacDermid Alpha Electronics Solutions
Speaker: Udo Welzel, Development Engineer, Robert Bosch Co. Ltd.
Seminar Type: Management
Track: Management
Location: 4
APTIV-Howard Presentation
MacDermid Alpha - D'Ambrisi Presentation
MicroTek Labs China - Neves Presentation
Nexteer Automotive-Wilson Presentation
Optimal-Hierbaum Presentation
ELGA EUROPE - Favini Presentation
Bosch - Welzel Presentation
GreenSource - Stepinski
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
JTAS-CITMIT
Seminar Type: Standard Development Committee
Location: 17B
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
2-17: Connected Factory Initative
Presenter/Committee Chair: Marc Peo, Heller Industries Inc.
Presenter/Committee Chair: Jason Spera, Aegis Software
Seminar Type: Standard Development Committee
General Committee: Electronic Product Data Description
Location: 17A
Mon, Jan 28, 2019 - 8:00 AM to 5:00 PM
2-18K: Material Declaration Data Exchange for Aerospace and Defense Task Group
Presenter/Committee Chair: Walter Jager, ECD Compliance
Presenter/Committee Chair: Rick Shanks, Pratt & Whitney
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 6F
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
3-11: Laminate/Prepreg Materials Subcommittee
Presenter/Committee Chair: Tony Senese, Panasonic Industrial Devices Sales Company of America
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 8
Mon, Jan 28, 2019 - 8:00 AM to 10:00 AM
5-21H: Bottom Termination Components (BTC) Task Group
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 14A
Mon, Jan 28, 2019 - 8:00 AM to 5:00 PM
5-22A/7-31B: Synergy Meeting - J-STD-001 & IPC-A-610 Task Groups
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Mon, Jan 28, 2019 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Specification Task Group
Presenter/Committee Chair: David Hillman, Rockwell Collins
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 9
Mon, Jan 28, 2019 - 8:00 AM to 10:00 AM
5-32A: Ion Chromatography/Ionic Conductivity Task Group
Presenter/Committee Chair: Joseph Russeau, Precision Analytical Laboratory, Inc.
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 10
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
7-31FS: IPC/WHMA-A-620 Space Electronic Assemblies Addendum Task Group
Presenter/Committee Chair: Garry McGuire, NASA Marshall Space Flight Center
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 14B
Mon, Jan 28, 2019 - 8:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Presenter/Committee Chair: Robert Cooke, NASA Johnson Space Center
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 11B
Mon, Jan 28, 2019 - 8:00 AM to 10:00 AM
D-32: Thermal Stress Test Methodology Subcommittee
Presenter/Committee Chair: James Monarchio, TTM Technologies
Seminar Type: Standard Development Committee
Track: Test
General Committee: Rigid Printed Circuit Boards
Location: 7A
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
2-19B: Trusted Supplier Task Group
Presenter/Committee Chair: Richard Snogren, Bristlecone LLC
Seminar Type: Standard Development Committee
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 16B
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
PD13: Design for Excellence: DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly) and More - Part 1
Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6C
PD13 Presentation - DaleLee
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
PD14: Assembly: Best Practices for Improving Manufacturing Productivity - Part 1
Presenter/Committee Chair: W. James Hall, Principal Consultant, ITM Consulting Inc.
Presenter/Committee Chair: Phil Zarrow, President and Principal Consultant, ITM Consulting Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6D
PD14 Presentation - Hall and Zarrow
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
PD15 Preventing Production Defects and Product Failures
Presenter/Committee Chair: Jennie Hwang, Ph.D., CEO, H-Technologies Group
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1A
PD15 Presentation - Jennie Hwang
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
PD16: Best DFM Practices for Board Engineers
Presenter/Committee Chair: Susy Webb, Sr. PCB Designer, Design Science
Seminar Type: Professional Development
Track: Design
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
PD16 Presentation - Susy Webb
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
PD17: Troubleshooting Printed Circuit Board Related Defects. Root Cause and Prevention - Part 1
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Intermediate - student should have some knowledge of the topic
Location: Room 2
PD17 Presentation - Mike Carano
Mon, Jan 28, 2019 - 9:00 AM to 12:00 PM
PD18: PWB Cooling Analysis
Presenter/Committee Chair: Patrick Loney, Advisory Engineer, Northrop Grumman
Seminar Type: Professional Development
Track: Design
Level: Intermediate - student should have some knowledge of the topic
Location: Room 3
PD18 Presentation - Patrick Loney
Mon, Jan 28, 2019 - 10:15 AM to 12:00 PM
5-31J: Cleaning Compatibility Task Group
Presenter/Committee Chair: Eddie Hofer, Rockwell Collins
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 10
Mon, Jan 28, 2019 - 10:15 AM to 12:00 PM
7-11: Test Methods Subcommittee
Presenter/Committee Chair: Joseph Russeau, Precision Analytical Laboratory, Inc.
Seminar Type: Standard Development Committee
Track: Test
General Committee: Testing
Location: 14A
Mon, Jan 28, 2019 - 10:15 AM to 12:00 PM
D-36: Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee
Presenter/Committee Chair: Albert Block Jr., National Instruments
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Rigid Printed Circuit Boards
Location: 7A
Mon, Jan 28, 2019 - 12:00 PM to 1:30 PM
Event Awards Luncheon
Seminar Type: Special Event
Location: 6A
Mon, Jan 28, 2019 - 12:00 PM to 1:30 PM
Government Relations Working Lunch
Seminar Type: Standard Development Committee
Location: 11A
Mon, Jan 28, 2019 - 1:30 PM to 5:00 PM

JTAS-OP-CANCELLED

Seminar Type: Standard Development Committee
Location: 17B
Mon, Jan 28, 2019 - 1:30 PM to 5:00 PM
1-10C: Test Coupon and Artwork Generation Task Group
Presenter/Committee Chair: Philip Henault, Raytheon Company
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Printed Board Design Technology
Location: 7A
Mon, Jan 28, 2019 - 1:30 PM to 5:00 PM
1:14:DFX Standards Subcommittee
Presenter/Committee Chair: Dock Brown, Senior Technical Staff, DfR Solutions
Presenter/Committee Chair: Karen McConnell, Northrop Grumman Corporation
Presenter/Committee Chair: Stephen Golemme, Google Inc.
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials and Design
General Committee: Printed Board Design Technology
Location: 14B
Mon, Jan 28, 2019 - 1:30 PM to 3:00 PM
2-19A: Critical Components Traceability Task Group
Presenter/Committee Chair: Michael Ford, Aegis Software
Presenter/Committee Chair: Cameron Shearon, Shearon-Consulting
Seminar Type: Standard Development Committee
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 16B
Mon, Jan 28, 2019 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Presenter/Committee Chair: Mike Bryant, BGF Industries Inc.
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 8
Mon, Jan 28, 2019 - 1:30 PM to 3:00 PM
5-33C: Conformal Coat Handbook
Presenter/Committee Chair: Amy Hagnauer, Raytheon Company
Presenter/Committee Chair: Jason Keeping, Celestica International L.P.
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 10
Mon, Jan 28, 2019 - 1:30 PM to 5:00 PM
D-33AM: IPC-6012 Medical Device Addendum Task Group
Presenter/Committee Chair: Jan Pedersen, Elmatica AS
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Boards
Location: 17A
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
PD19: Design for Excellence: DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly) and More - Part 2
Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6C
PD19 Instructor - DaleLee
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
PD20: Assembly: Best Practices for Improving Manufacturing Productivity - Part 2
Presenter/Committee Chair: W. James Hall, Principal Consultant, ITM Consulting Inc.
Presenter/Committee Chair: Phil Zarrow, President and Principal Consultant, ITM Consulting Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6D
PD20 Presentation - Hall and Zarrow
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
PD21: Reliability Physics Introduction and DfX Applications
Presenter/Committee Chair: Dock Brown, Senior Technical Staff, DfR Solutions
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Basic - broad foundation
Location: Room 1A
PD21 Presentation - Dock Brown
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
PD22: Reflow Soldering Process and Influence on Defects - An In-Depth Look
Presenter/Committee Chair: S. Manian Ramkumar, Ph.D., Interim Dean, Rochester Institute of Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 3
PD22 Presentation - Manian Ramkumar
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
PD23: Troubleshooting Printed Circuit Board Related Defects. Root Cause and Prevention - Part 2
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Intermediate - student should have some knowledge of the topic
Location: Room 2
PD23 Presentation - Mike Carano
Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM
PD24: Continuous Improvement Through Lean Practices
Presenter/Committee Chair: Steven Williams, President, TRA Consulting
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
PD24 Presentation - Steve Williams
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable Task Group
Presenter/Committee Chair: Terry Fischer, Hitachi Chemical Co. America, Ltd.
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 8
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
5-32B: SIR and Electrochemical Migration Task Group
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 10
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
5-33g Low Pressure Molding Task Group
Presenter/Committee Chair: Russell Steiner, Casco Products
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 9
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
B-10A/JEDEC: Joint Meeting: Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1
Presenter/Committee Chair: Stephen Tisdale, Tisdale Environmental Consulting LLC
Presenter/Committee Chair: Steven Martell
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Packaged Electronic Components
Location: 12
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Presenter/Committee Chair: Joseph Kane, BAE Systems
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Rigid Printed Circuit Boards
Location: 14A
Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM
IPC-2581/Fujiko Harmonization
Seminar Type: Standard Development Committee
Mon, Jan 28, 2019 - 5:00 PM to 6:00 PM
Complimentary IPC First-Timers Welcome Reception
Seminar Type: Special Event
Location: 7B
Mon, Jan 28, 2019 - 5:00 PM to 6:30 PM
Technical Activities Executive Committee (By Invitation)
Presenter/Committee Chair: Don Dupriest, Lockheed Martin Missles & Fire Control
Presenter/Committee Chair: Chris Mahanna, Robisan Laboratory Inc.
Seminar Type: Standard Development Committee
Location: 15A
Mon, Jan 28, 2019 - 5:30 PM to 6:30 PM
Complimentary International Reception
Seminar Type: Special Event
Location: West Terrace
Mon, Jan 28, 2019 - 6:00 PM to 9:00 PM
VIP Dinner(IPC Members Only)
Seminar Type: Management
Location: Searsuckers
Tue, Jan 29, 2019 - 7:00 AM to 8:00 AM
Hall of Fame Breakfast (By Invitation)
Seminar Type: Management
Location: 8
Tue, Jan 29, 2019 - 7:30 AM to 8:30 AM

Technical Conference Speaker's Breakfast (By Invitation)

Seminar Type: Special Event
Location: Room 3
Tue, Jan 29, 2019 - 8:30 AM to 9:30 AM
Complimentary Opening Keynote Session
JB STRAUBEL Chief Technical Officer (CTO) and Co-Founder, Tesla, Inc.
Accelerating and Disrupting
Innovation: The Tesla Story
Speaker: JB Straubel, Chief Technical Officer (CTO) and Co-Founder, Tesla, Inc.
Seminar Type: Special Event
Location: 6A
Tue, Jan 29, 2019 - 9:45 AM to 10:00 AM
Ribbon Cutting Ceremony
Seminar Type: Special Event
Location: Lobby D
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
D-33AT – IPC-6012 training advisory committee
Seminar Type: Standard Development Committee
Location: 17B
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
2-30: Terms and Definitions Committee
Presenter/Committee Chair: Steven Bowles, DuPont Silicon Valley Technology Center
Presenter/Committee Chair: Vicka Hammill, Honeywell Inc. Air Transport Systems
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Terms and Definitions
Location: 14B
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
2-40: Electronic Documentation Technology Committee
Presenter/Committee Chair: Gary Carter, ThingWeaver Solutions, LLC
Seminar Type: Standard Development Committee
Track: Production Design and Development
General Committee: Electronic Documentation Technology
Location: 6E
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
3-12A; Metallic Foil Task Group
Presenter/Committee Chair: Rolland Savage, Savage Consulting
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 10
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
5-21A: IPC-7070 Task Group
Presenter/Committee Chair: Kristopher Moyer, CSUS
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 9
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
5-21K: IPC-SM-817 SMT Adhesive Task Group
Presenter/Committee Chair: Lance Brack, Raytheon Missile Systems
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
5-22ARR: J-STD-001/Conformal Coating Material & Application Industry Assessment
Presenter/Committee Chair: David Hillman, Rockwell Collins
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Tue, Jan 29, 2019 - 10:00 AM to 5:00 PM
7-31BV: Automotive Addendum Task Group
Presenter/Committee Chair: Jose Servin Olivares, Continental Temic SA deCV
Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch Co. Ltd.
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 14A
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
D-24D: High Frequency Loss Test Methods Task Group
Presenter/Committee Chair: Xiaoning Ye, Intel Corporation
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: High Spped/High Frequency Interconnections
Location: 16B
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Environmental Policy Update
Seminar Type: Special Event
Location: 5A
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Joint Meeting: 5-22H/5-45
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Presenter/Committee Chair: Linda Woody, LWC Consulting
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Assembly and Joining
Location: 12
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
Material Declaration Data Exchange for Aerospace & Defense Task Group
Presenter/Committee Chair: Walter Jager, ECD Compliance
Presenter/Committee Chair: Rick Shanks, Pratt & Whitney
Seminar Type: Standard Development Committee
Tue, Jan 29, 2019 - 10:00 AM to 12:00 PM
V-TSL: Technology Solutions Committee
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standard Development Committee
Location: 7A
Tue, Jan 29, 2019 - 12:00 PM to 1:30 PM
Event Luncheon & IPC Annual Meeting
Seminar Type: Special Event
Location: 6A
Tue, Jan 29, 2019 - 1:00 PM to 5:00 PM
5-22AD/5-22AS:Joint Meeting: Req. for Military Systems and Space Electronic Assemblies J-STD-001 Addendum
Presenter/Committee Chair: Gary Latta, SAIC
Presenter/Committee Chair: Garry McGuire, NASA Marshall Space Flight Center
Seminar Type: Standard Development Committee
Location: 11B
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
5-32E: Conductive Anodic Filament (CAF) Task Group
Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 17A
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
S05: Low Temperature Alloys I
Presenter/Committee Chair: Beverley Christian, HDP User Group
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability
Location: 6D
S05: Low Temperature Alloys I
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
BZ1:  E-Textiles – The Fourth Industrial Revolution
Presenter/Committee Chair: Stephanie Rogers, Apex Mills, Inc.
Seminar Type: Buzz Session
Location: Room 4
BZ1 - MaryAlice Gill
BZ1 - Stephanie Rodgers
BZ1 - Len Allison - EMS
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Presenter/Committee Chair: Karen McConnell, Northrop Grumman Corporation
Presenter/Committee Chair: Kristopher Moyer, CSUS
Seminar Type: Standard Development Committee
Track: Design
General Committee: Printed Board Design Technology
Location: 9
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
2-18: Supplier Declaration Subcommittee
Presenter/Committee Chair: Tord Dennis, WSP Parsons Brinckerhoff
Presenter/Committee Chair: Walter Jager, ECD Compliance
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 6F
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
2-18H: Conflict Minerals Data Exchange Task Group
Seminar Type: Standard Development Committee
General Committee: Electric Product Data Description
Location: 8
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
4-33: Halogen-Free Materials Subcommittee
Presenter/Committee Chair: Douglas Sober, Essex Technologies Group Inc.
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Environment, Health & Saftey (EHS)
Location: 10
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
5-24A: Flux Specifications Task Group
Presenter/Committee Chair: Brook Sandy-Smith, Technical Support Engineer, IPC
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 12
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
5-33A: Conformal Coating Task Group
Presenter/Committee Chair: Jeffrey Sargeant, HumiSeal Division of Chase Corporation
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 15A
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
7-24: Printed Board Process Effects Handbook Subcommittee
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Process Control
Location: 7A
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
7-31FT - IPC/WHMA-A-620 Training Advisory Committee Meeting
Seminar Type: Standard Development Committee
General Committee: Assembly and Joining
Location: 17B
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
D-24C: High Frequency Test Methods Task Group: Frequency-Domain Methods
Presenter/Committee Chair: John Coonrod, Rogers Corporation
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: High Spped/High Frequency Interconnections
Location: 16B
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Presenter/Committee Chair: Clifford Maddox, Boeing Company
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Printed Board Design Technology
Location: 14B
Tue, Jan 29, 2019 - 1:30 PM to 5:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Presenter/Committee Chair: Rajesh Kumar
Seminar Type: Standard Development Committee
Track: Emerging Technologies
General Committee: Embedded Devices
Location: 6E
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
S01: Dispensing/Jetting
Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation
Seminar Type: Technical Conference Session
Track: Printed Electronics
Location: ROOM 2
S01: Dispensing/Jetting
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
S02: PCB Fabrication/Plating I
Speaker: Julie Silk, Reliability Program Manager, Keysight Technologies
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability
Location: 6C
S02: PCB Fabrication/Plating I
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
S03: Assembly/Inspection (BTC/ BGA)
Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability
Location: ROOM 1A
S03: Assembly/Inspection (BTC/ BGA)
Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM
S04: Test/Inspection I
Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability
Location: 1B
S04: Test/Inspection I
Tue, Jan 29, 2019 - 2:00 PM to 4:00 PM
Export Control Compliance: A Regulatory Update and Forecast
Seminar Type: Special Event
Location: 5
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
3-11F:UL/CSA Task Group
Presenter/Committee Chair: Beverley Christian, HDP User Group
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Base Materials
Location: 10
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
5-22A Rose Working Group
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 7A
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Presenter/Committee Chair: Jennie Hwang, Ph.D., CEO, H-Technologies Group
Seminar Type: Standard Development Committee
Location: 12
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Test Methods Task Group
Presenter/Committee Chair: Reza Ghaffarian, Jet Propulsion Laboratory
Seminar Type: Standard Development Committee
Track: Product Reliability
Location: 17A
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
7-34: Repairability Subcommittee
Presenter/Committee Chair: Daniel Foster, Missile Defense Agency
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 15A
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
D-24B: Bereskin Test Method Task Group
Presenter/Committee Chair: David Wynants, Taconic Advanced Dielectric Division
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: High Spped/High Frequency Interconnections
Location: 16B
Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM
D-33AA: IPC-6012 Automotive Addendum Task Group
Presenter/Committee Chair: Jan Pedersen, Elmatica AS
Seminar Type: Standard Development Committee
Location: 11A
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM

BZ2:  How IPC-2581 Enables Industry 4.0

Presenter/Committee Chair: Ed Acheson, Cadence Design Systems Inc.
Presenter/Committee Chair: Terry Hoffman, Cisco Systems Inc.
Presenter/Committee Chair: Hemant Shah, Cadence Design Systems Inc.
Speaker: Michael Ford, Aegis Software
Presenter/Committee Chair: Gary Carter, ThingWeaver Solutions, LLC
Seminar Type: Buzz Session
Location: Room 4
BZ2: How IPC-2581 Enables Industry 4.0
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM
S10:  PCB Surface Finishes I
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: 6D
S10: PCB Surface Finishes I
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM
S06: Printed Electronics I
Presenter/Committee Chair: Stanton Rak, Head of Materials Technology, Continental Automotive
Speaker: Woonhong Yeo, Georgia Institute of Technology
Presenter/Committee Chair: Benjamin Leever, Advanced Development Team Leader, Air Force Research Laboratory
Seminar Type: Technical Conference Session
Track: Printed Electronics Track
Location: ROOM 2
S06: Printed Electronics I
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM
S07: PCB/Microvia Reliability
Jeff Schake, Senior Engineer, ASM Assembly Systems
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: 6C
S07: PCB/Microvia Reliability
Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM
S09: Test/Inspection II
Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 2
Location: 1B
S09: Test/Inspection II
Tue, Jan 29, 2019 - 5:00 PM to 6:00 PM
Complimentary Show Floor Reception
Seminar Type: Special Event
Wed, Jan 30, 2019 - 7:30 AM to 8:30 AM

Technical Conference Speaker's Breakfast (By Invitation)

Seminar Type: Special Event
Location: Room 3
Wed, Jan 30, 2019 - 7:30 AM to 9:00 AM
2-16D: :IPC-2581 User's Group
Presenter/Committee Chair: Gary Carter, ThingWeaver Solutions, LLC
Presenter/Committee Chair: Kevin Kusiak, Lockheed Martin Space Systems Company
Seminar Type: Standard Development Committee
Track: PCB Fabrication, Materials and Design
General Committee: Electronic Product Data Description
Location: 10
Wed, Jan 30, 2019 - 8:00 AM to 12:00 PM
2-18B: Materials Declaration Task Group
Presenter/Committee Chair: Mark Frimann, Texas Instruments Inc.
Presenter/Committee Chair: Aidan Turnbull, BomCheck
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 8
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
Presenter/Committee Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 17A
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
5-21G: Flip Chip Mounting Task Group
Presenter/Committee Chair: Ife Hsu, Intel Corporation
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
5-22F: J-STD-001 Handbook Task Group
Presenter/Committee Chair: John Mastorides, Honeywell Aerospace
Presenter/Committee Chair: Scott Meyer, UTC Aerospace Systems
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 7A
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
5-24B: Solder Paste Task Group
Presenter/Committee Chair: Karen Tellefsen, Alpha Assembly Solutions
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11A
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
5-33AWG: Conformal Coating Requirements Working Group
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 9
Wed, Jan 30, 2019 - 8:00 AM to 12:00 PM
7-31AT – IPC-A-600 training advisory committee
Seminar Type: Standard Development Committee
Location: 17B
Wed, Jan 30, 2019 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Presenter/Committee Chair: Richard Rumas, Honeywell Canada
Presenter/Committee Chair: Catherine Hanlin
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 15A
Wed, Jan 30, 2019 - 8:00 AM to 12:00 PM
7-31H/7-31K: Joint Meeting - IPC-HDBK-620 Handbook and Wire Harness Design Task Groups
Presenter/Committee Chair: Robert Cooke, NASA Johnson Space Center
Seminar Type: Standard Development Committee
Track: Design
General Committee: Product Assurance
Location: 16B
Wed, Jan 30, 2019 - 8:00 AM to 12:00 PM
7-35: Assembly and Joining Handbook Subcommittee
Presenter/Committee Chair: Mary Muller
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Product Assurance
Location: 14A
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
D-15: Flexible Circuits Test Methods Subcommittee
Presenter/Committee Chair: Russell Sheperd
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 12
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM
D-22: High Speed/High Frequency Board Performance Subcommittee
Presenter/Committee Chair: Lance Auer, Conductor Analysis Technologies, Inc.
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: High Spped/High Frequency Interconnections
Location: 14B
Wed, Jan 30, 2019 - 9:00 AM to 10:00 AM

BZ3:  The Future of Pb-free in High Reliability Applications – Results of an Industry Survey

Presenter/Committee Chair: David A Pinsky, Raytheon Company
Presenter/Committee Chair: Paul Zutter, US Army Aviation & Missile Command
Speaker: Linda Woody, LWC Consulting
Speaker: David Hillman, Rockwell Collins
Seminar Type: Buzz Session
Location: Room 5A
BZ3: The Future of Pb-free in High Reliability Applications – Results of an Industry Survey
Wed, Jan 30, 2019 - 9:00 AM to 12:00 PM
2-16: Product Data Description (2581)
Presenter/Committee Chair: Gary Carter, ThingWeaver Solutions, LLC
Presenter/Committee Chair: Chris Shaw, Fujitsu Network Communications
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials and Design
General Committee: Electronic Product Data Description
Location: 10
Wed, Jan 30, 2019 - 10:00 AM to 10:30 PM
Poster Presentations - No charge to attend
Posters are also scheduled to be presented at 4:30pm - 5:00pm on Wednesday, January 30, 2019
Seminar Type: Poster
Location: A
2019 Poster Presentations
Wed, Jan 30, 2019 - 10:00 AM to 6:00 PM
WORLD CHAMPIONSHIP HSC AND REWORK
Seminar Type: Management
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM
V-TSL-MVIA: Open Forum: Weak Interface Microvia Failures Technology Solutions Subcommittee

 
Presenter/Committee Chair: Marc Carter, Printed Circuit Engineer/Systems Integration Team Manager, SAIC
Presenter/Committee Chair: Dennis Fritz
Seminar Type: Standard Development Committee
Location: 11A
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM
4-14: Plating Processes Subcommittee
Presenter/Committee Chair: George Milad, Uyeura International Corp
Presenter/Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Fabrication Processes
Location: 7A
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM
5-21F: Ball Grid Array Task Group
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Wed, Jan 30, 2019 - 10:15 AM to 3:00 PM
5-33B: Solder Mask Performance Task Group
Presenter/Committee Chair: Rene Martinez, Northrop Grumman Corporation
Presenter/Committee Chair: Fonda Wu, Raytheon Company
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 9
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM
D-12: Flexible Circuits Specifications Subcommittee
Presenter/Committee Chair: Nick Koop, Sr. Field Application Engineering - Flex Technology, TTM Technologies
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 12
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
BZ4:  Impacts of Warpage on SMT Processes
Presenter/Committee Chair: Brook Sandy-Smith, Technical Support Engineer, IPC
Seminar Type: Buzz Session
Location: Room 4
Impacts of Warpage on SMT Processes
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S12: Printed Electronics II
Presenter/Committee Chair: Weifeng Liu, Flextronics International
Seminar Type: Technical Conference Session
Track: Printed Electronics Track
Location: 6D
S12: Printed Electronics II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S13: PCB Fabrication and Plating II
Speaker: Stanton Rak, Head of Materials Technology, Continental Automotive
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: 6C
S13: PCB Fabrication and Plating II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S14: Low Temperature Alloys II
Presenter/Committee Chair: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
S14: Low Temperature Alloys II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S15: Adhesives/Silicone Greases
Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 2
Location: ROOM 2
S15: Adhesives/Silicone Greases
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly
Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3 Design
Location: 1B
S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly
Wed, Jan 30, 2019 - 12:00 PM to 1:30 PM
Event Awards Luncheon
Seminar Type: Special Event
Location: 6A
Wed, Jan 30, 2019 - 12:00 PM to 1:00 PM
Tradeshow Committee Meeting(By Invitation)
Seminar Type: Standard Development Committee
Location: 17A
Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM

2-18: Supplier Declaration Subcommittee

Seminar Type: Standard Development Committee
Location: 7A
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
S20: Cleaning
Speaker: Denis Jean, Kester
Seminar Type: Technical Conference Session
Track: Cleaning
Location: ROOM 1B
S20: Cleaning
Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM
4-30: EHS Committee
Seminar Type: Standard Development Committee
Location: 6E
Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM
5-21M: Cold Joining/Press-fit Task Group
Presenter/Committee Chair: Hans-Peter Tranitz, Continental Automotive GmbH
Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch Co. Ltd.
Seminar Type: Standard Development Committee
Location: 14A
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
5-24F: Underfill Materials Design, Selection and Process Task Group
Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation
Presenter/Committee Chair: Bill Vuono, Qorvo
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 8
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
7-12: Microsection Subcommittee
Presenter/Committee Chair: Russell Sheperd
Seminar Type: Standard Development Committee
Track: Test
General Committee: Testing
Location: 12
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
D-11: Flexible Circuits Design Subcommittee
Presenter/Committee Chair: William Ortloff, Raytheon Company
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
D-23: High Speed/High Frequency Base Materials Subcommittee
Presenter/Committee Chair: Edward Sandor, Taconic Advanced Dielectric Division
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: High Spped/High Frequency Interconnections
Location: 11B
Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM
D-60: Printed Electronics Committee Reporting Session
Presenter/Committee Chair: Neil Bolding, MacDermid Enthone Electronics Solutions
Presenter/Committee Chair: Daniel Gamota, Printovate Technologies
Seminar Type: Standard Development Committee
General Committee: Printed Electronics
Location: 16B
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
S18: Reliability / Embedded Components/ Power Electronics/ Thermal Modelling/ Mechanical Shock Testing
Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
S18: Reliability / Embedded Components/ Power Electronics/ Thermal Modelling/ Mechanical Shock Testi
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
S19: Solder Paste/ Reliability II
Presenter/Committee Chair: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
S19: Solder Paste/ Reliability II
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
S21: High Speed/High Frequency Laminate Materials Used in Design
Speaker: David Hoover, Sr Field Application Engineer, TTM Technologies
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: ROOM 2
S21: High Speed/High Frequency Laminate Materials Used in Design
Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM
Training Committee Orientation Meeting
Seminar Type: Standard Development Committee
Location: 17B
Wed, Jan 30, 2019 - 2:30 PM to 3:30 PM
Ice Cream Social On The Show Floor
Seminar Type: Special Event
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
5-31G: Stencil Cleaning Task Group
Presenter/Committee Chair: Mike Bixenman, Kyzen Corporation
Presenter/Committee Chair: Greg Wade, Indium Corporation
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 8
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
8-41: Technology Roadmap Subcommittee
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Presenter/Committee Chair: John Fisher, Interconnect Technology Anlysis Inc.
Seminar Type: Standard Development Committee
Track: Supply Chain/Business Issues
General Committee: Managemnet
Location: 11A
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
B-11: 3-D Electronic Packages Subcommittee
Presenter/Committee Chair: Dudi Amir, Intel Corporation
Presenter/Committee Chair: Vern Solberg, Solberg Technical Consulting
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Packaged Electronic Components
Location: 12
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
Certification Committee Orientation Meeting
Seminar Type: Standard Development Committee
Location: 17B
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials Subcommittee
Presenter/Committee Chair: Clark Webster, ALL Flex LLC
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
D-21: High Speed/High Frequency Design Subcommittee
Presenter/Committee Chair: Scott Bowles, L3 Fuzing and Ordnance Systems, Cincinnati
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: High Spped/High Frequency Interconnections
Location: 17A
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
IPC Solder Products Value Council
Seminar Type: Management
Track: PCB Fabrication and Materials
Location: 11B
Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM
V-SPVC: Solder Products Value Council
Seminar Type: Standard Development Committee
Location: 11B
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
BZ5:  Findings from IPC's PCB Technology Trends
Presenter/Committee Chair: Sharon Starr, Director of Market Research, IPC
Speaker: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Buzz Session
Location: Room 4
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
S22: Printed Electronics IV
Presenter/Committee Chair: Benjamin Leever, Advanced Development Team Leader, Air Force Research Laboratory
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: D
S22: Printed Electronics IV
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
S23: PCB Surface Finishes II
Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch Co. Ltd.
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
S23: PCB Surface Finishes II
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
S24: Solder Paste/ Reliability III
Presenter/Committee Chair: Stanton Rak, Head of Materials Technology, Continental Automotive
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 2
Location: ROOM 2
S24: Solder Paste/ Reliability III
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
S25: Failure Analysis
Presenter/Committee Chair: Beverley Christian, HDP User Group
Seminar Type: Technical Conference Session
Track: Manufacturing Software
Location: C
S25: Failure Analysis
Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM
S26: Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: ROOM 1B
S26: Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
Wed, Jan 30, 2019 - 4:00 PM to 4:30 PM
Awards Presentation
Seminar Type: Special Event
Location: Sails Pavilion
Wed, Jan 30, 2019 - 5:30 PM to 7:00 PM
MIT Meet and Greet(By Invitation Only)
Seminar Type: Standard Development Committee
Location: 17B
Wed, Jan 30, 2019 - 6:00 PM to 7:00 PM
Women in Electronics Networking Reception
Speaker: Dr. Cortney Baker
Seminar Type: Special Event
Location: 5A
Wed, Jan 30, 2019 - 6:30 PM to 8:00 PM
Trivia Networking Night
Seminar Type: Special Event
Location: Room 4
Thu, Jan 31, 2019 - 7:30 AM to 8:30 AM

Technical Conference Speaker's Breakfast (By Invitation)

Seminar Type: Special Event
Location: Room 3
Thu, Jan 31, 2019 - 8:00 AM to 2:00 PM

BZ6:  iNemi NEXT GENERATION SOLDER MATERIALS WORKSHOP

Speaker: Dr. Haley Fu, iNEMI
Seminar Type: Buzz Session
Location: Room 4
Thu, Jan 31, 2019 - 8:00 AM to 12:00 PM

5-21M: Cold Joining/Press-fit Task Group

Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch Co. Ltd.
Presenter/Committee Chair: Hans-Peter Tranitz, Continental Automotive GmbH
Seminar Type: Standard Development Committee
Location: 17A
Thu, Jan 31, 2019 - 8:00 AM to 2:00 PM
2-18B: Materials Declaration Task Group
Seminar Type: Standard Development Committee
Location: 6F
Thu, Jan 31, 2019 - 8:00 AM to 10:00 AM
3-11G: Corrosion of Metal Finishes Task Group
Seminar Type: Standard Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Base Materials
Location: 14A
Thu, Jan 31, 2019 - 8:00 AM to 5:00 PM
7-31J: Electronic Box Assemblies Task Group
Presenter/Committee Chair: Eddie Hofer, Rockwell Collins
Presenter/Committee Chair: Richard Rumas, Honeywell Canada
Seminar Type: Standard Development Committee
General Committee: Product Assurance
Location: 15A
Thu, Jan 31, 2019 - 8:00 AM to 5:00 PM
D-63a Printed Electronics Functional Dielectric Materials Task Group-CANCELLED
 
Presenter/Committee Chair: Haridoss Sarma, GO 2 Scout 4 R&T
Seminar Type: Standard Development Committee
Location: 12
Thu, Jan 31, 2019 - 8:00 AM to 9:00 AM
SMEMA Council Meeting
Seminar Type: Standard Development Committee
General Committee: Managemnet
Location: 16B
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
PD25: Cost Effective Design for Testability and Test Strategies with JTAG/Boundary Scan
Presenter/Committee Chair: Louis Ungar, President, A.T.E. Solutions, Inc.
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate - student should have some knowledge of the topic
Location: Room 11B
PD25 Presentation - Louis Ungar
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
PD26: Thermal Management Solutions using PCB's
Presenter/Committee Chair: Mike Tucker, Field Applications Engineering Manager, Kinwong Electronics Corporation
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Basic - broad foundation
Location: Room 11A
PD26 Presentation - Mike Tucker
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
PD27: Ask the Flexperts - Lessons Learned
Presenter/Committee Chair: Mark Finstad, Senior Appication Engineer, Flexible Circuit Technologies, Inc.
Presenter/Committee Chair: Nick Koop, Sr. Field Application Engineering - Flex Technology, TTM Technologies
Seminar Type: Professional Development
Track: Design
Level: Intermediate - student should have some knowledge of the topic
Location: Room 10
PD27 Presentation - Finstad and Koop
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
PD28: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration
Presenter/Committee Chair: Ning-Cheng Lee, Ph.D., VP of Technology, Indium Corporation
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 9
PD28 Presentation - Ning-Cheng Lee
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
PD29: Selective Soldering of Challenging Components
Presenter/Committee Chair: Bob Klenke, Principal Consultant, ITM Consulting Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 8
PD29 Presentation - Bob Klenke
Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM
PD30: Electrostatic Discharge (ESD) " Sources of Electrostatic Charge in a Production Line (SMT) " Robotic as a Source of Electrostatic Charge in the Future
Presenter/Committee Chair: Hartmut Berndt, B.E.STAT European ESD Competence Centre
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate - student should have some knowledge of the topic
Location: Room 7B
PD30 Presentation - Hartmut Berndt
Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM
S27: High Speed/High Frequency I
Presenter/Committee Chair: David Hoover, Sr Field Application Engineer, TTM Technologies
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: D
S27: High Speed/High Frequency I
Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM
S28: Environmental
Presenter/Committee Chair: Julie Silk, Reliability Program Manager, Keysight Technologies
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: C
S28: Environmental
Thu, Jan 31, 2019 - 10:00 AM to 11:00 AM
PCB Suppliers Council Steering Committee Meeting(By Invitation)
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
Location: 14A
Thu, Jan 31, 2019 - 10:00 AM to 2:00 PM
UL STP Committee (By invitation only)
Presenter/Committee Chair: Bradley Schmidt, UL LLC
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Testing
Location: 16B
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
S35:  Smart Manufacturing/ Industry 4.0/ Software Manufacturing Tools
Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC
Seminar Type: Technical Conference Session
Track: Manufacturing Software Track
Location: ROOM 1B
S35: Smart Manufacturing/ Industry 4.0/ Software Manufacturing Tools
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
S33: Conformal Coating
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: D
S33: Conformal Coating
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
S34: Assembly/Emerging Technologies
Presenter/Committee Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
Seminar Type: Technical Conference Session
Track: Cleaning/Coating/Contamination
Location: 6C
S34: Assembly/Emerging Technologies
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
S36: Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion
Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: ROOM 1A
S36: Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion
Thu, Jan 31, 2019 - 1:00 PM to 5:00 PM
2-18J: Laboratory Report Declaration Task Group
Presenter/Committee Chair: Jason Gooden, Anthesis
Presenter/Committee Chair: JB Hollister, Apple Inc.
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14B