Jan 26, 2019 - Jan 31, 2019
San Diego Convention Center
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM
D-12: Flexible Circuits Specifications Subcommittee
Presenter/Committee Chair: Nick Koop, Sr. Field Application Engineering - Flex Technology, TTM Technologies
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 12
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
BZ4:  Impacts of Warpage on SMT Processes
Presenter/Committee Chair: Brook Sandy-Smith, Technical Support Engineer, IPC
Seminar Type: Buzz Session
Location: Room 4
Impacts of Warpage on SMT Processes
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S12: Printed Electronics II
Presenter/Committee Chair: Weifeng Liu, Flextronics International
Seminar Type: Technical Conference Session
Track: Printed Electronics Track
Location: 6D
S12: Printed Electronics II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S13: PCB Fabrication and Plating II
Speaker: Stanton Rak, Head of Materials Technology, Continental Automotive
Seminar Type: Technical Conference Session
Track: PCB Fabrication/ Plating/Reliability Track
Location: 6C
S13: PCB Fabrication and Plating II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S14: Low Temperature Alloys II
Presenter/Committee Chair: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: ROOM 1A
S14: Low Temperature Alloys II
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S15: Adhesives/Silicone Greases
Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 2
Location: ROOM 2
S15: Adhesives/Silicone Greases
Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM
S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly
Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3 Design
Location: 1B
S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly
Wed, Jan 30, 2019 - 12:00 PM to 1:30 PM
Event Awards Luncheon
Seminar Type: Special Event
Location: 6A
Wed, Jan 30, 2019 - 12:00 PM to 1:00 PM
Tradeshow Committee Meeting(By Invitation)
Seminar Type: Standard Development Committee
Location: 17A
Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM

2-18: Supplier Declaration Subcommittee

Seminar Type: Standard Development Committee
Location: 7A