Agenda Planner - Programs

Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM D-15: Flexible Circuits Test Methods Subcommittee Presenter/Committee Chair: Russell Sheperd Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials General Committee: Flexible and Rigid-Flex Printed Boards Location: 12
Wed, Jan 30, 2019 - 8:00 AM to 10:00 AM D-22: High Speed/High Frequency Board Performance Subcommittee Presenter/Committee Chair: Lance Auer, Conductor Analysis Technologies, Inc. Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials General Committee: High Spped/High Frequency Interconnections Location: 14B
Wed, Jan 30, 2019 - 9:00 AM to 10:00 AM BZ3: The Future of Pb-free in High Reliability Applications – Results of an Industry Survey Presenter/Committee Chair: David A Pinsky, Raytheon Company Presenter/Committee Chair: Paul Zutter, US Army Aviation & Missile Command Speaker: Linda Woody, LWC Consulting Speaker: David Hillman, Rockwell Collins Seminar Type: Buzz Session Location: Room 5A BZ3: The Future of Pb-free in High Reliability Applications – Results of an Industry Survey
Wed, Jan 30, 2019 - 9:00 AM to 12:00 PM 2-16: Product Data Description (2581) Presenter/Committee Chair: Gary Carter, ThingWeaver Solutions, LLC Presenter/Committee Chair: Chris Shaw, Fujitsu Network Communications Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials and Design General Committee: Electronic Product Data Description Location: 10
Wed, Jan 30, 2019 - 10:00 AM to 10:30 PM Poster Presentations - No charge to attend Posters are also scheduled to be presented at 4:30pm - 5:00pm on Wednesday, January 30, 2019 Seminar Type: Poster Location: A 2019 Poster Presentations
Wed, Jan 30, 2019 - 10:00 AM to 6:00 PM WORLD CHAMPIONSHIP HSC AND REWORK Seminar Type: Management
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM V-TSL-MVIA: Open Forum: Weak Interface Microvia Failures Technology Solutions Subcommittee Presenter/Committee Chair: Marc Carter, Printed Circuit Engineer/Systems Integration Team Manager, SAIC Presenter/Committee Chair: Dennis Fritz Seminar Type: Standard Development Committee Location: 11A
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM 4-14: Plating Processes Subcommittee Presenter/Committee Chair: George Milad, Uyeura International Corp Presenter/Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc. Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials General Committee: Fabrication Processes Location: 7A
Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM 5-21F: Ball Grid Array Task Group Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group Seminar Type: Standard Development Committee Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 11B
Wed, Jan 30, 2019 - 10:15 AM to 3:00 PM 5-33B: Solder Mask Performance Task Group Presenter/Committee Chair: Rene Martinez, Northrop Grumman Corporation Presenter/Committee Chair: Fonda Wu, Raytheon Company Seminar Type: Standard Development Committee Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 9