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Programs: 21 - 29 of 29

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	Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM S24: Solder Paste/ Reliability III Presenter/Committee Chair: Stanton Rak, Head of Materials Technology, Continental Automotive Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 2 Location: ROOM 2 S24: Solder Paste/ Reliability III
	Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM S25: Failure Analysis Presenter/Committee Chair: Beverley Christian, HDP User Group Seminar Type: Technical Conference Session Track: Manufacturing Software Location: C S25: Failure Analysis
	Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM S26: Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Location: ROOM 1B S26: Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
	Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM S27: High Speed/High Frequency I Presenter/Committee Chair: David Hoover, Sr Field Application Engineer, TTM Technologies Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track Location: D S27: High Speed/High Frequency I
	Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM S28: Environmental Presenter/Committee Chair: Julie Silk, Reliability Program Manager, Keysight Technologies Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: C S28: Environmental
	Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM S35: Smart Manufacturing/ Industry 4.0/ Software Manufacturing Tools Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC Seminar Type: Technical Conference Session Track: Manufacturing Software Track Location: ROOM 1B S35: Smart Manufacturing/ Industry 4.0/ Software Manufacturing Tools
	Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM S33: Conformal Coating Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: D S33: Conformal Coating
	Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM S34: Assembly/Emerging Technologies Presenter/Committee Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 6C S34: Assembly/Emerging Technologies
	Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM S36: Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Location: ROOM 1A S36: Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion

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