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	Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S05: Low Temperature Alloys I Presenter/Committee Chair: Beverley Christian, HDP User Group Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Location: 6D S05: Low Temperature Alloys I
	Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S01: Dispensing/Jetting Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation Seminar Type: Technical Conference Session Track: Printed Electronics Location: ROOM 2 S01: Dispensing/Jetting
	Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S02: PCB Fabrication/Plating I Speaker: Julie Silk, Reliability Program Manager, Keysight Technologies Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Location: 6C S02: PCB Fabrication/Plating I
	Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S03: Assembly/Inspection (BTC/ BGA) Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Location: ROOM 1A S03: Assembly/Inspection (BTC/ BGA)
	Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM S04: Test/Inspection I Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Location: 1B S04: Test/Inspection I
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S10: PCB Surface Finishes I Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Location: 6D S10: PCB Surface Finishes I
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S06: Printed Electronics I Presenter/Committee Chair: Stanton Rak, Head of Materials Technology, Continental Automotive Speaker: Woonhong Yeo, Georgia Institute of Technology Presenter/Committee Chair: Benjamin Leever, Advanced Development Team Leader, Air Force Research Laboratory Seminar Type: Technical Conference Session Track: Printed Electronics Track Location: ROOM 2 S06: Printed Electronics I
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S07: PCB/Microvia Reliability Jeff Schake, Senior Engineer, ASM Assembly Systems Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track Location: 6C S07: PCB/Microvia Reliability
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S09: Test/Inspection II Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 2 Location: 1B S09: Test/Inspection II
	Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S12: Printed Electronics II Presenter/Committee Chair: Weifeng Liu, Flextronics International Seminar Type: Technical Conference Session Track: Printed Electronics Track Location: 6D S12: Printed Electronics II

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