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	Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM PD22: Reflow Soldering Process and Influence on Defects - An In-Depth Look Presenter/Committee Chair: S. Manian Ramkumar, Ph.D., Interim Dean, Rochester Institute of Technology Seminar Type: Professional Development Track: Assembly Processes for Lead-Free and Tin Lead Level: Intermediate - student should have some knowledge of the topic Location: Room 3 PD22 Presentation - Manian Ramkumar
	Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM PD23: Troubleshooting Printed Circuit Board Related Defects. Root Cause and Prevention - Part 2 Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc. Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Intermediate - student should have some knowledge of the topic Location: Room 2 PD23 Presentation - Mike Carano
	Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM PD24: Continuous Improvement Through Lean Practices Presenter/Committee Chair: Steven Williams, President, TRA Consulting Seminar Type: Professional Development Track: Quality, Reliability and Test Level: Intermediate - student should have some knowledge of the topic Location: Room 1B PD24 Presentation - Steve Williams
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD25: Cost Effective Design for Testability and Test Strategies with JTAG/Boundary Scan Presenter/Committee Chair: Louis Ungar, President, A.T.E. Solutions, Inc. Seminar Type: Professional Development Track: Quality, Reliability and Test Level: Intermediate - student should have some knowledge of the topic Location: Room 11B PD25 Presentation - Louis Ungar
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD26: Thermal Management Solutions using PCB's Presenter/Committee Chair: Mike Tucker, Field Applications Engineering Manager, Kinwong Electronics Corporation Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Basic - broad foundation Location: Room 11A PD26 Presentation - Mike Tucker
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD27: Ask the Flexperts - Lessons Learned Presenter/Committee Chair: Mark Finstad, Senior Appication Engineer, Flexible Circuit Technologies, Inc. Presenter/Committee Chair: Nick Koop, Sr. Field Application Engineering - Flex Technology, TTM Technologies Seminar Type: Professional Development Track: Design Level: Intermediate - student should have some knowledge of the topic Location: Room 10 PD27 Presentation - Finstad and Koop
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD28: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration Presenter/Committee Chair: Ning-Cheng Lee, Ph.D., VP of Technology, Indium Corporation Seminar Type: Professional Development Track: Assembly Processes for Lead-Free and Tin Lead Level: Intermediate - student should have some knowledge of the topic Location: Room 9 PD28 Presentation - Ning-Cheng Lee
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD29: Selective Soldering of Challenging Components Presenter/Committee Chair: Bob Klenke, Principal Consultant, ITM Consulting Inc. Seminar Type: Professional Development Track: Assembly Processes for Lead-Free and Tin Lead Level: Intermediate - student should have some knowledge of the topic Location: Room 8 PD29 Presentation - Bob Klenke
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD30: Electrostatic Discharge (ESD) " Sources of Electrostatic Charge in a Production Line (SMT) " Robotic as a Source of Electrostatic Charge in the Future Presenter/Committee Chair: Hartmut Berndt, B.E.STAT European ESD Competence Centre Seminar Type: Professional Development Track: Quality, Reliability and Test Level: Intermediate - student should have some knowledge of the topic Location: Room 7B PD30 Presentation - Hartmut Berndt

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