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Jan 26, 2019 - Jan 31, 2019
San Diego Convention Center
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Date
Sun, Jan 27th, 2019
Mon, Jan 28th, 2019
Thu, Jan 31st, 2019
Type
Professional Development
Track
Assembly Processes for Lead-Free and Tin Lead
Cleaning/Coating/Contamination
Design
PCB Fabrication and Materials
Quality, Reliability and Test
Supply Chain/Business Issues
Speaker
Barrie Dunn, University of Portsmouth
Bob Klenke, ITM Consulting Inc.
Dale Lee, Plexus Corporation
Dock Brown, DfR Solutions
Douglas Pauls, Rockwell Collins
Gustaf Martensson, Ph.D., Mycronic AB / KTH
Hartmut Berndt, B.E.STAT European ESD Competence Centre
James Barnhart, BEST Inc
Jeffrey Roth, F&B Law Firm, P.C.
Jennie Hwang, Ph.D., H-Technologies Group
Jim Vanden Hogen, San Diego PCB
John Lau, Ph.D., ASM Assembly Materials Ltd.
Louis Ungar, A.T.E. Solutions, Inc.
Mark Finstad, Flexible Circuit Technologies, Inc.
Michael Carano, RBP Chemical Technology, Inc.
Mike Tucker, Kinwong Electronics Corporation
Nick Koop, TTM Technologies
Ning-Cheng Lee, Ph.D., Indium Corporation
Norman Mier Jr., BEST Inc.
Patrick Loney, Northrop Grumman
Phil Zarrow, ITM Consulting Inc.
Ray Prasad, Ray Prasad Consultancy Group
S. Manian Ramkumar, Ph.D., Rochester Institute of Technology
Steven Williams, TRA Consulting
Susy Webb, Design Science
W. James Hall, ITM Consulting Inc.
Location
Room 10
Room 11A
Room 11B
Room 1A
Room 1B
Room 2
Room 3
Room 6C
Room 6D
Room 7B
Room 8
Room 9
Level
Advanced - detailed content, high-level discussion
Basic - broad foundation
Intermediate - student should have some knowledge of the topic
No programs are available.
