Jan 26, 2019 - Jan 31, 2019
San Diego Convention Center

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Programs: 1 - 10 of 29
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD01: Non Contact Additive Technologies in Contemporary Electronics Production and Related Fields
Presenter/Committee Chair: Gustaf Martensson, Ph.D., Expert Complex Fluids, Mycronic AB / KTH
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Basic - broad foundation
Location: Room 6C
PD01 Presentation - Gustaf Martensson
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD02: SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 1
Presenter/Committee Chair: S. Manian Ramkumar, Ph.D., Interim Dean, Rochester Institute of Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6D
PD02 Presentation - Dr. S. Manian Ramkumar
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD03: PCB Fabrication Basics: Process and Specification
Presenter/Committee Chair: Jim Vanden Hogen, PCB Designer, San Diego PCB
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Basic - broad foundation
Location: Room 3
PD03 Presentation - Jim Vanden Hogen
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD04: Advanced Rework: Hands-on BGA Reballing and Leadless Devices - Part 1
Presenter/Committee Chair: James Barnhart, Master Instructor/Course Developer, BEST Inc
Presenter/Committee Chair: Norman Mier Jr., Senior Technical Trainer, BEST Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Advanced - detailed content, high-level discussion
Location: Room 2
PD04 Presentation - Mier and Barnhart
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD05: Flip Chip, WLCSP, and FOWLP Assembly and Reliability
Presenter/Committee Chair: John Lau, Ph.D., Sr. Technical Advisor, ASM Assembly Materials Ltd.
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
PD05 Presentation - John Lau
Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
PD06: J-STD-001 and Ionic Residue Testing
Presenter/Committee Chair: Douglas Pauls, Principle Materials and Process Engineer, Rockwell Collins
Seminar Type: Professional Development
Track: Cleaning/Coating/Contamination
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1A
PD06 Presentation - Doug Pauls
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
PD07: Contracting with the Customer: What the EMS Manager and Executive Needs to Know
Presenter/Committee Chair: Jeffrey Roth, Attorney, F&B Law Firm, P.C.
Seminar Type: Professional Development
Track: Supply Chain/Business Issues
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6C
PD07 Presentation - Roth and Anderson
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Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
PD08: SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 2
Presenter/Committee Chair: S. Manian Ramkumar, Ph.D., Interim Dean, Rochester Institute of Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Basic - broad foundation
Location: Room 6D
PD08 Presentation - Manian Ramkumar
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
PD09: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1A
PD09 Presentation - Ray Prasad
Sun, Jan 27, 2019 - 2:00 PM to 5:00 PM
PD10: Advanced Rework: Hands-on BGA Reballing and Leadless Devices - Part 2
Presenter/Committee Chair: James Barnhart, Master Instructor/Course Developer, BEST Inc
Presenter/Committee Chair: Norman Mier Jr., Senior Technical Trainer, BEST Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Advanced - detailed content, high-level discussion
Location: Room 2
PD10 Presentation - Mier and Barnhart