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Jan 26, 2019 - Jan 31, 2019
San Diego Convention Center
Print List of Programs
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Date
Sat, Jan 26th, 2019
Sun, Jan 27th, 2019
Mon, Jan 28th, 2019
Tue, Jan 29th, 2019
Wed, Jan 30th, 2019
Thu, Jan 31st, 2019
Type
Standard Development Committee
Buzz Session
Special Event
Management
Poster
Professional Development
Technical Conference Session
Track
Assembly Processes for Lead Free and Tin-Lead
Assembly Processes for Lead-Free and Tin Lead
Cleaning
Cleaning/Coating/Contamination
Design
Emerging Technologies
Environmental Issues and Compliance
Management
Manufacturing Software
Manufacturing Software Track
PCB Assembly, Inspection and Reliability
PCB Assembly, Inspection and Reliability Track 1
PCB Assembly, Inspection and Reliability Track 2
PCB Assembly, Inspection and Reliability Track 3
PCB Assembly, Inspection and Reliability Track 3 Design
PCB Fabrication and Materials
PCB Fabrication and Materials and Design
PCB Fabrication, Materials and Design
PCB Fabrication/ Plating/Reliability
PCB Fabrication/ Plating/Reliability Track
Printed Electronics
Printed Electronics Track
Product Reliability
Production Design and Development
Quality, Reliability and Test
Supply Chain/Business Issues
Test
Speaker
Aidan Turnbull, BomCheck
Albert Block Jr., National Instruments
Alexander Stepinski, GreenSource Fabrication, LLC, Whelen Engineering Company, Inc.
Alun Morgan, Ventec
Amy Hagnauer, Raytheon Company
Barrie Dunn, University of Portsmouth
Benjamin Leever, Air Force Research Laboratory
Beverley Christian, HDP User Group
Bill Vuono, Qorvo
Bob Klenke, ITM Consulting Inc.
Bob Neves
Bradley Schmidt, UL LLC
Brian Toleno, Microsoft Corporation
Brook Sandy-Smith, IPC
Cameron Shearon, Shearon-Consulting
Carlo Favini, Elga Europe
Catherine Hanlin
Chaim Lubin, Lincoln International
Chris Mahanna, Robisan Laboratory Inc.
Chris Shaw, Fujitsu Network Communications
Clark Webster, ALL Flex LLC
Clifford Maddox, Boeing Company
Dale Lee, Plexus Corporation
Daniel Foster, Missile Defense Agency
Daniel Gamota, Printovate Technologies
David A Pinsky, Raytheon Company
David Hillman, Rockwell Collins
David Hoover, TTM Technologies
David Wynants, Taconic Advanced Dielectric Division
Denis Jean, Kester
Dennis Fritz
Dock Brown, DfR Solutions
Don Cullen, MacDermid Alpha Electronics Solutions
Don Dupriest, Lockheed Martin Missles & Fire Control
Douglas Pauls, Rockwell Collins
Douglas Sober, Essex Technologies Group Inc.
Dr. Cortney Baker
Dr. Haley Fu, iNEMI
Dudi Amir, Intel Corporation
Dwight Howard, APTIV
Ed Acheson, Cadence Design Systems Inc.
Eddie Hofer, Rockwell Collins
Edward Sandor, Taconic Advanced Dielectric Division
Fonda Wu, Raytheon Company
Garry McGuire, NASA Marshall Space Flight Center
Gary Carter, ThingWeaver Solutions, LLC
Gary Latta, SAIC
George Milad, Uyeura International Corp
Gerard O'Brian, Solderability Testing & Solutions, Inc.
Greg Wade, Indium Corporation
Gustaf Martensson, Ph.D., Mycronic AB / KTH
Hans-Peter Tranitz, Continental Automotive GmbH
Haridoss Sarma, GO 2 Scout 4 R&T
Hartmut Berndt, B.E.STAT European ESD Competence Centre
Hemant Shah, Cadence Design Systems Inc.
Ife Hsu, Intel Corporation
JB Hollister, Apple Inc.
JB Straubel
Jack Calderon, Lincoln International
James Barnhart, BEST Inc
James Monarchio, TTM Technologies
Jan Pedersen, Elmatica AS
Jason Gooden, Anthesis
Jason Keeping, Celestica International L.P.
Jason Spera, Aegis Software
Jeff Schake, ASM Assembly Systems
Jeff Shubrooks, Raytheon Company
Jeffrey Roth, F&B Law Firm, P.C.
Jeffrey Sargeant, HumiSeal Division of Chase Corporation
Jennie Hwang, Ph.D., H-Technologies Group
Jim Vanden Hogen, San Diego PCB
Joe D'Ambrisi, MacDermid Alpha Electronics Solutions
John Caltabiano, Jabil
John Coonrod, Rogers Corporation
John Fisher, Interconnect Technology Anlysis Inc.
John Lau, Ph.D., ASM Assembly Materials Ltd.
John Mastorides, Honeywell Aerospace
Jose Servin Olivares, Continental Temic SA deCV
Joseph Kane, BAE Systems
Joseph Russeau, Precision Analytical Laboratory, Inc.
Julie Silk, Keysight Technologies
Karen McConnell, Northrop Grumman Corporation
Karen Tellefsen, Alpha Assembly Solutions
Karl Sauter, Oracle America, Inc.
Kevin Kusiak, Lockheed Martin Space Systems Company
Kristopher Moyer, CSUS
Lance Auer, Conductor Analysis Technologies, Inc.
Lance Brack, Raytheon Missile Systems
Larry Wilson III, Nexteer Automotive
Leo Lambert, EPTAC Corporation
Linda Woody, LWC Consulting
Louis Ungar, A.T.E. Solutions, Inc.
Marc Carter, SAIC
Marc Peo, Heller Industries Inc.
Mark Finstad, Flexible Circuit Technologies, Inc.
Mark Frimann, Texas Instruments Inc.
Martin Goetz, Northrop Grumman Corporation
Mary Muller
Matt Kelly, IBM Corporation
Michael Carano, RBP Chemical Technology, Inc.
Michael Ford, Aegis Software
Michael Jawitz, Northrop Grumman Corporation
Mike Bixenman, Kyzen Corporation
Mike Bryant, BGF Industries Inc.
Mike Tucker, Kinwong Electronics Corporation
Milos Lazic, Indium Corporation
Neil Bolding, MacDermid Enthone Electronics Solutions
Neil Hamlett, IBM Watson
Nick Koop, TTM Technologies
Ning-Cheng Lee, Ph.D., Indium Corporation
Norman Mier Jr., BEST Inc.
Olaf Korn, Arrow Electronics
Patrick Loney, Northrop Grumman
Paul Zutter, US Army Aviation & Missile Command
Phil Zarrow, ITM Consulting Inc.
Philip Henault, Raytheon Company
Rajesh Kumar
Randy Hierbaum, Optimal+
Ray Prasad, Ray Prasad Consultancy Group
Rene Martinez, Northrop Grumman Corporation
Reza Ghaffarian, Jet Propulsion Laboratory
Richard Rumas, Honeywell Canada
Richard Snogren, Bristlecone LLC
Rick Shanks, Pratt & Whitney
Robert Cooke, NASA Johnson Space Center
Robert Fornefeld, L3 Communications
Rolland Savage, Savage Consulting
Russell Nowland, Nokia
Russell Sheperd
Russell Steiner, Casco Products
S. Manian Ramkumar, Ph.D., Rochester Institute of Technology
Scott Bowles, L3 Fuzing and Ordnance Systems, Cincinnati
Scott Meyer, UTC Aerospace Systems
Sharon Starr, IPC
Stanton Rak, Continental Automotive
Stephanie Rogers, Apex Mills, Inc.
Stephen Golemme, Google Inc.
Stephen Tisdale, Tisdale Environmental Consulting LLC
Steve Butkovich, Test Innovation, LLC
Steve Ulm, Vishay
Steven Bowles, DuPont Silicon Valley Technology Center
Steven Martell
Steven Williams, TRA Consulting
Susy Webb, Design Science
Terry Fischer, Hitachi Chemical Co. America, Ltd.
Terry Hoffman, Cisco Systems Inc.
Tony Senese, Panasonic Industrial Devices Sales Company of America
Tord Dennis, WSP Parsons Brinckerhoff
Udo Welzel, Robert Bosch Co. Ltd.
Vern Solberg, Solberg Technical Consulting
Vicka Hammill, Honeywell Inc. Air Transport Systems
W. James Hall, ITM Consulting Inc.
Walter Jager, ECD Compliance
Weifeng Liu, Flextronics International
William Ortloff, Raytheon Company
Woonhong Yeo, Georgia Institute of Technology
Xiaoning Ye, Intel Corporation
Location
4
5
8
9
10
11A
11B
12
14A
14B
15A
16B
17A
17B
1B
5A
6A
6C
6D
6E
6F
7A
7B
A
C
D
Lobby D
Room 10
Room 11A
Room 11B
Room 1A
Room 1B
Room 2
Room 3
Room 4
Room 5A
Room 6C
Room 6D
Room 7B
Room 8
Room 9
Sails Pavilion
Searsuckers
West Terrace
General Committee
Assembly and Joining
Base Materials
Cleaning and Coating
Electric Product Data Description
Electronic Documentation Technology
Electronic Product Data Description
Embedded Devices
Environment, Health & Saftey (EHS)
Fabrication Processes
Flexible and Rigid-Flex Printed Boards
High Spped/High Frequency Interconnections
Managemnet
Packaged Electronic Components
Printed Board Design Technology
Printed Electronics
Process Control
Product Assurance
Rigid Printed Boards
Rigid Printed Circuit Boards
Terms and Definitions
Testing
Level
Advanced - detailed content, high-level discussion
Basic - broad foundation
Intermediate - student should have some knowledge of the topic
Programs: 201 - 204 of 204
Programs per Page
5
10
20
30
50
100
500
1000
All
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
S33: Conformal Coating
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 1
Location: D
S33: Conformal Coating
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
S34: Assembly/Emerging Technologies
Presenter/Committee Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
Seminar Type: Technical Conference Session
Track: Cleaning/Coating/Contamination
Location: 6C
S34: Assembly/Emerging Technologies
Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM
S36: Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion
Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia
Seminar Type: Technical Conference Session
Track: PCB Assembly, Inspection and Reliability Track 3
Location: ROOM 1A
S36: Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion
Thu, Jan 31, 2019 - 1:00 PM to 5:00 PM
2-18J: Laboratory Report Declaration Task Group
Presenter/Committee Chair: Jason Gooden, Anthesis
Presenter/Committee Chair: JB Hollister, Apple Inc.
Seminar Type: Standard Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14B
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