About the Company:
ATCO designs and manufactures equipment for soldering, rework, bonding, and thermal stress testing of printed circuit boards and microelectronics. Products include: SMD/BGA Placement & Rework Stations, Reflow Soldering Ovens, Flip Chip / Die Bonders, Reflow Simulators and Thermal Stress Tester for... (more)
Additional Information:
Company's Categories:
- Assembly Equipment: Flip-Chip Technology
- Assembly Equipment: Fine-Pitch Placement
- Ball Placement Systems & Equipment
- Die Bonding Equipment
- Flip Chip Bonding Equipment
- Printed Electronics: Equipment
- Prototyping
- Repair & Rework
- Solderability Test Systems
- Soldering Equipment: Reflow (Ovens)
- Soldering Irons/Tips/& Stations
- Test and Inspection: Equipment-Package
- Soldering Equipment: Other
- Microvias/Embedded Components
