Jan 26, 2019 - Jan 31, 2019
San Diego Convention Center
Uyemura International Corporation
Uyemura International Corporation
Booth: 533
Uyemura advanced finishing solutions include TWX-40 mixed reaction autocatalytic gold, a reduction-assisted gold bath that meets the demand for thicker gold in ENIG, ENEPIG. Highest uniformity gold deposits up to 8µin independent of pad sizes & PCB surface potential. Also: EVF-R via fill copper... (more)